MV2N4091UB/TR

Overview

The MV2N4091UB/TR is an N-channel Junction Field-Effect Transistor (JFET) manufactured by Microchip Technology. It utilizes silicon technology and is designed for surface-mount installation in a UB package configuration. The device features a maximum drain-source breakdown voltage of 40 V and a gate-source breakdown voltage of -40 V. Key electrical parameters include a zero-gate-voltage drain current of 30 mA, a continuous drain current of 100 pA, and a drain-source on-resistance of 30 Ohms. The component supports a power dissipation of 360 mW and operates within a temperature range from -65°C to +175°C.

Feature Summary

• Surface-mount construction utilizing the UB package format for compact circuit integration
• Silicon-based N-channel JFET architecture providing high-temperature operational stability
• Single transistor configuration optimized for precision analog signal processing applications

Applications

• High-frequency analog signal amplification circuits
• Precision low-noise amplifier stages
• Variable resistance control networks in electronic systems

Procurement Notes

Verify the specific UB surface-mount package designation against schematic requirements. Confirm that the 360 mW power dissipation rating aligns with thermal management constraints. Ensure the -65°C to +175°C operating temperature range meets environmental specifications. Cross-reference the 40 V breakdown limits with circuit voltage peaks to prevent device failure during operation.

Selection Notes

Select this component when surface-mount topology is required for N-channel JFET applications. The UB package facilitates automated assembly processes compared to through-hole alternatives. Consider the 30 mA zero-gate-voltage current specification for biasing network design. Evaluate the high-temperature capability for environments exceeding standard commercial ranges.

Part Context

This part belongs to the Microchip Technology JFET product line, specifically engineered for robust performance in demanding electronic environments. The UB suffix indicates a specialized surface-mount variant distinct from traditional leaded packages. It serves as a modern alternative to older through-hole designs while maintaining comparable electrical characteristics for legacy system upgrades.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing footprints before considering alternative manufacturers or package variations.