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MVDF2C03HDR2G is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET N/P-CH 30V 4.1A/3A 8SOIC. Review the specifications below when checking this part for your BOM.
The MVDF2C03HDR2G is a complementary MOSFET array featuring N-channel and P-channel configurations housed in an 8-SOIC package. It provides a drain-to-source voltage rating of 30V with continuous drain current capabilities of 4.1A for the N-channel device and 3A for the P-channel device. Designed as a logic level gate component, this dual FET assembly integrates both channel types into a single compact surface-mount footprint to facilitate efficient circuit design.
Verify the specific ordering suffix 'R2G' against the manufacturer's official datasheet to confirm tape-and-reel packaging specifications and quantity per reel. Ensure the 8-SOIC package dimensions match the PCB footprint requirements. Confirm that the 30V voltage rating and current limits align with the target application's electrical stress conditions before finalizing procurement.
Select this component when a space-saving solution requiring both N-type and P-type switching elements is necessary. The logic level gate feature allows direct drive from standard microcontroller GPIO pins without additional driver circuitry. Consider the 8-SOIC thermal performance and the specific 4.1A/3A current ratings to ensure adequate headroom for the intended load currents.
This part belongs to onsemi's discrete semiconductor transistor category, specifically within the FET and MOSFET arrays segment. It represents a consolidated power switching solution designed to reduce board space and simplify bill-of-materials by integrating complementary channels into a single package, replacing the need for two separate discrete MOSFET components.
Cross-reference with other 30V complementary MOSFET arrays in the 8-SOIC package. Verify pinout compatibility and thermal resistance characteristics when substituting with equivalent parts from other manufacturers to ensure seamless integration without redesigning the printed circuit board layout.
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