ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IGBT MODULE 1200V 110A 360W E3
- Series：-
- Mfr：IXYS
- Package：Box
- IGBT Type：Trench
- Configuration：Three Phase Inverter
- Vce(on) (Max) @ Vge, Ic：2.1V @ 15V, 75A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 125°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：E3
- Supplier Device Package：E3
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：110 A
- Power - Max：360 W
- Current - Collector Cutoff (Max)：3 mA
- Input Capacitance (Cies) @ Vce：5.35 nF @ 25 V
Download product information
Overview
The MWI75-12T8T is a six-pack Trench IGBT module manufactured by IXYS. It features a maximum off-state voltage of 1.2 kV and a collector current rating of 75 A. The component utilizes the E3-Pack case style with electrical press-in PCB mounting. This silicon-based power semiconductor device is designed for high-efficiency switching applications in industrial and energy conversion systems.
Feature Summary
- Six-pack Trench IGBT configuration
- E3-Pack case style
- Electrical press-in PCB mounting
Applications
- Motor drives
- Photovoltaic systems
Procurement Notes
Verify part authenticity through authorized IXYS distributors or certified agents. Confirm package integrity and pin alignment prior to installation. Ensure storage conditions comply with manufacturer specifications to prevent moisture damage. Cross-reference datasheet revisions for any parameter updates before final design integration.
Selection Notes
Select this module for applications requiring 1.2 kV blocking capability and 75 A continuous current handling. The E3-Pack form factor supports direct PCB integration via press-in terminals, simplifying assembly compared to screw-mount alternatives. Evaluate thermal management requirements based on the specific power dissipation characteristics defined in the official datasheet.
Part Context
This component belongs to the MWI series of six-pack IGBT modules from IXYS. These devices are engineered for robust performance in medium-power switching environments. The Trench technology offers improved switching characteristics compared to planar designs, supporting efficient operation in modern power electronics architectures.
Replacement Considerations
Direct substitutes include the MWI75-12T7T variant within the same IXYS product line. Verify pin compatibility and thermal interface dimensions when considering alternative packages or manufacturers. Consult official replacement guides for cross-reference accuracy.
