NB2308AC1D

Overview

The NB2308AC1D is a commercial-grade, 3.3 V zero delay clock buffer manufactured by onsemi. It features an integrated PLL that locks to a reference clock input on the REF pin, with feedback provided via the FBK pin. The device provides eight buffered outputs organized into two banks of four (Bank A and Bank B), which can be selectively enabled or three-stated using S1 and S2 select inputs. It operates within a frequency range of 15 MHz to 133.3 MHz and supports supply voltages from 3.0 V to 3.6 V. The component is housed in a 16-pin SOIC package.

Feature Summary

• Zero Delay Buffer: Input-to-output propagation delay is adjustable via capacitive load on the FBK pin; guaranteed less than 250 ps.
• Low Skew Performance: Output-to-output skew is less than 200 ps, and device-to-device skew is less than 700 ps.
• Configurable Outputs: Two banks of four outputs allow for flexible distribution; Bank B can be three-stated independently.
• Cycle-to-Cycle Jitter: Guaranteed less than 200 ps under standard loading conditions.

Applications

• High-speed clock distribution networks
• System testing and chip validation via direct input bypass mode
• Multi-device synchronization requiring low inter-device skew

Procurement Notes

Verify the specific ordering suffix 'C' confirms the commercial temperature range (0°C to +70°C). Confirm the 'D' suffix indicates the SOIC-16 package variant. Check RoHS compliance status if lead-free packaging is required for assembly processes.

Selection Notes

Select this part when a fixed 1:8 ratio with reference frequency output is needed. Ensure the application requires the commercial temperature range. Verify that the load capacitance requirements align with the 30 pF limit below 100 MHz or 15 pF above 100 MHz to maintain specified jitter and rise/fall times.

Part Context

This component belongs to the NB2308A family of zero delay buffers. The 'C' designation specifies the commercial operating temperature range, distinguishing it from the industrial grade 'I' variants. It utilizes advanced 0.35 µm CMOS technology and is available in both SOIC-16 and TSSOP-16 packages.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.