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NTMYS003N08LHTWG is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists onsemi. Its product description is T8 80V LL LFPAK. Review the specifications below when checking this part for your BOM.
The NTMYS003N08LHTWG is a single N-channel power MOSFET manufactured by onsemi. It features an 80 V drain-to-source voltage rating and a maximum continuous drain current of 132 A at TC = 25°C. The device offers a low on-resistance of 3.3 mΩ at VGS = 10 V and 4.3 mΩ at VGS = 4.5 V. Packaged in the LFPAK4 (CASE 760AB) footprint measuring 5x6 mm, it provides high thermal performance with a junction-to-case thermal resistance of 1.1 °C/W. The component operates within a temperature range of -55°C to +175°C.
Verify the specific ordering suffix 'TWG' against official documentation to confirm tape and reel packaging quantities and shipping specifications. Ensure that the application environment matches the thermal resistance conditions defined in the datasheet, as ambient factors significantly impact actual performance limits. Confirm compliance requirements align with project standards before finalizing procurement.
Select this component when designing circuits requiring high current handling capabilities within a small surface-mount footprint. Evaluate the thermal management strategy carefully, as the device relies heavily on PCB copper area for heat dissipation. Consider the gate threshold voltage characteristics to ensure compatibility with available drive voltages for optimal switching efficiency.
This part belongs to the NVMYS/NTMYS series of low-voltage power MOSFETs from onsemi. These devices are engineered to balance electrical performance with physical size constraints. The LFPAK4 package is widely adopted in the industry for its standardized dimensions and superior thermal transfer properties compared to traditional packages.
Consult official substitution guides or manufacturer cross-reference lists to identify compatible alternatives. Verify that any substitute maintains identical pinout configurations, voltage ratings, and thermal characteristics to ensure seamless integration without redesigning the printed circuit board layout.
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