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NTMYS3D3N06CLTWG is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists onsemi. Its product description is MOSFET N-CH 60V 26A/133A LFPAK4. Review the specifications below when checking this part for your BOM.
The NTMYS3D3N06CLTWG is an N-channel Power MOSFET manufactured by onsemi, designed for high-efficiency power switching applications. It features a 60V drain-source breakdown voltage and supports a continuous drain current of 26A at ambient temperature (Ta) or 133A at case temperature (Tc). The device utilizes the LFPAK4 (SOT-1023) surface-mount package, which provides low thermal resistance and robust mechanical stability. Key electrical characteristics include a maximum on-resistance (Rds(on)) of 3mΩ, ensuring minimal conduction losses. It is qualified under AEC-Q101 standards, making it suitable for automotive environments, with an operating junction temperature range extending up to 175°C.
Verify the specific suffix 'TWG' confirms the tape-and-reel packaging format and lead-free compliance as per manufacturer specifications. Confirm AEC-Q101 qualification status if automotive application requires formal certification documentation. Ensure thermal management design accounts for the specified RthJA parameters in the final assembly layout.
Select this component when a low-profile, high-current N-channel MOSFET is required for automotive or industrial DC switching. Compare Rds(on) and gate charge values against alternative packages to optimize drive circuit complexity. Verify that the LFPAK4 thermal dissipation capabilities meet the system's power loss constraints under worst-case operating temperatures.
This part belongs to onsemi's NVMYS series of automotive-grade MOSFETs. It is engineered for high-density power applications where space constraints and thermal efficiency are critical. The LFPAK4 package is part of a standardized family of surface-mount devices designed to replace larger through-hole or standard SMD packages in modern PCB layouts.
Check pinout compatibility and thermal pad configuration when substituting with other LFPAK4 devices. Verify that alternative parts meet the same 60V rating and current handling capabilities. Ensure gate threshold voltage levels remain compatible with existing driver logic.
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