NVG800A75L4DSB2

Overview

The NVG800A75L4DSB2 is an automotive-grade half-bridge power module from the VE-Trac/C0116 Dual Gen II series, designed for hybrid and electric vehicle traction inverters. It utilizes narrow mesa Field Stop (FS4) IGBT technology to deliver high current density and robust short-circuit protection. The module features dual-side cooling capabilities with a continuous operating junction temperature range of -40°C to 175°C. Key electrical ratings include a collector-emitter voltage of 750 V, an implemented collector current of 800 A, and a pulsed collector current of 1600 A. It incorporates integrated chip-level temperature and current sensors for enhanced system monitoring.

Feature Summary

• Dual-side cooling design with low-stray inductance architecture
• Integrated on-chip temperature and current sensing capabilities
• Automotive grade qualification with AEC standards compliance
• High blocking voltage and robust short circuit withstand capability

Applications

• Hybrid and Electric Vehicle Traction Inverter
• High Power DC-DC Converter

Procurement Notes

Verify the specific ordering suffix against official documentation to confirm package type and shipping configuration. Ensure that the procurement channel provides valid traceability data required for automotive applications. Confirm RoHS compliance status and Pb-free designation prior to finalizing orders. Cross-reference the assembly lot code markings with the manufacturer's latest marking diagram to ensure authenticity and correct identification.

Selection Notes

Select this component when designing systems requiring high current density and compact footprints for EV traction applications. Evaluate thermal management requirements based on the specified junction-to-case resistance values under liquid cooling conditions. Consider the integrated sensor outputs for implementing over-current protection and accurate thermal monitoring strategies within the inverter control loop.

Part Context

This device belongs to the VE-Trac/C0116 Dual Gen II family of power modules. It shares the same mechanical footprint and cooling interface as other variants in the series, facilitating modular design approaches. The FS4 IGBT chipset distinguishes it by offering improved switching performance and higher blocking voltage tolerance compared to previous generations.

Replacement Considerations

Direct replacements must match the 750V/800A rating and AHPM15-CEC package outline. Verify pin compatibility, specifically the integrated sensor terminals. Consult the manufacturer for updated datasheets regarding potential supersessions or alternative packages within the same thermal and electrical performance class.