SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The NVG800A75L4DSC2 is an automotive-grade half-bridge power module from the VE-Trac/C0116 Dual Gen II family, designed for hybrid and electric vehicle traction inverters. It integrates two narrow mesa Field Stop (FS4) IGBTs with a complementary diode in a compact AHPM15-CEA package. The device supports a continuous collector current of 550 A at 175°C junction temperature and withstands up to 800 A pulsed current. Key electrical ratings include a 750 V blocking voltage, 4.2 kV isolated DBC substrate, and low-stray inductance of 8 nH. Integrated chip-level temperature and current sensors facilitate precise thermal management and overcurrent protection.
Verify the specific ordering suffix against official documentation to confirm packaging details and shipping configurations. Ensure compatibility with liquid cooling heatsink reference designs when integrating into inverter systems. Confirm that all mechanical mounting parameters align with the designated module case outline specifications prior to assembly.
Select this component for applications requiring high current density and robust short-circuit withstand capability in EV traction environments. Evaluate thermal resistance values relative to the intended fluid flow rate and coolant mixture. Consider the integrated sensor outputs for implementing advanced overcurrent and overtemperature protection strategies within the control loop.
This module belongs to the VE-Trac/C0116 Dual Gen II series, which utilizes advanced narrow mesa IGBT technology. The family is engineered specifically for compact footprints and dual-side cooling requirements typical in modern electric drive units. It represents a generation of power modules optimized for high blocking voltages and improved switching characteristics.
Consult official onsemi documentation for confirmed substitute part numbers. Verify pinout compatibility and thermal interface requirements before substituting any alternative components.
The maximum continuous operating junction temperature (Tvj max) is 175°C.
It features an integrated chip-level current sense output that enables faster and simpler implementation of overcurrent protection (OCP).
The module utilizes a 4.2 kV isolated DBC (Direct Bonded Copper) substrate.