NXH350N100H4Q2F2S1G

Overview

The NXH350N100H4Q2F2S1G is a three-level Neutral Point Clamped (NPC) inverter module manufactured by onsemi. It utilizes EliteSiC technology, combining Silicon IGBTs with Silicon Carbide components for enhanced performance. The device features a Q2PACK surface-mount package with dimensions of 93.1mm length and 12.3mm height. Key electrical specifications include a maximum collector-emitter voltage (VCEO) of 1000 V and a maximum power dissipation (Pd) of 592 W. The module supports a junction temperature range from -40°C to 175°C and includes an integrated NTC thermistor for thermal monitoring.

Feature Summary

• Integrates a three-level NPC topology within a compact Q2PACK surface-mount footprint
• Combines silicon trench field-stop IGBTs with silicon carbide diodes for improved switching efficiency
• Includes an integrated NTC thermistor for precise internal temperature sensing

Applications

• Solar string inverters
• Uninterruptible power supply systems
• Energy storage system converters

Procurement Notes

Verify the specific suffix S1G against official datasheets to confirm the Q2PACK surface-mount configuration and pinout compatibility. Ensure that the thermal interface material selection aligns with the specified maximum junction temperature of 175°C. Cross-reference the manufacturer part number directly with onsemi documentation to avoid confusion with similar P1G through-hole variants.

Selection Notes

Select this component when a low-profile surface-mount solution is required for high-power density applications. The combination of 1000 V blocking capability and 592 W power dissipation suits medium-power inverter designs. Verify that the PCB layout accommodates the 93.1mm x 47mm Q2PACK dimensions and that the gate drive circuitry supports the standard input requirements.

Part Context

This module belongs to the NXH350 series, which represents onsemi's EliteSiC product line. The series focuses on hybrid Si/SiC solutions designed to reduce system size and improve efficiency in renewable energy and industrial power conversion. The Q2PACK form factor allows for automated surface-mount assembly, facilitating higher production throughput compared to traditional bolted modules.

Replacement Considerations

Direct replacements must match the 1000 V rating, 592 W dissipation, and Q2PACK surface-mount package. Verify pin-to-pin compatibility with existing PCB footprints. Consider the NXH350N100H4Q2F2P1G only if through-hole mounting is acceptable, as it shares similar electrical characteristics but differs in physical installation method.