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The NXH400B100H4Q2F2SG is a Q2BOOST power module containing two-channel flying capacitor boost circuits. It integrates field stop trench IGBTs and SiC Schottky diodes within a PIM50 package (93x47 mm). The device features a collector-emitter voltage of 1000 V, a continuous collector current of 164 A at Tc=80°C, and a maximum power dissipation of 396 W. Operating junction temperatures range from -40°C to 175°C, with an isolation test voltage of 4000 VRMS.
Verify the specific ordering suffix 'SG' confirms solder pin configuration rather than press-fit pins. Confirm RoHS compliance status and assembly site codes via official documentation before procurement. Ensure thermal interface material specifications match the required thermal resistance values for your application design.
Select this module for applications requiring high-efficiency boost conversion with integrated thermal sensing. Compare the 164 A continuous current rating against peak load requirements. Evaluate the 1000 V blocking capability against system DC bus voltages. Consider the PIM50 footprint constraints during mechanical design.
This component belongs to onsemi's Q2BOOST series, designed specifically for flying capacitor boost topologies. It utilizes EliteSiC technology to combine silicon IGBTs with silicon carbide diodes. The module is part of a broader family including variants with different pin configurations like the PG suffix.
NXH400B100H4Q2F2PG is the direct alternative with press-fit pins instead of solder pins. Verify pin compatibility and mounting hardware differences when substituting. Electrical characteristics remain identical between the SG and PG variants.