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Product Detailed Parameters
- Description：MASS MARKET 250KW 1500V Q2 PACK
- Series：-
- Mfr：onsemi
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Level Inverter
- Vce(on) (Max) @ Vge, Ic：2.3V @ 15V, 400A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：42-PIM/Q2PACK (93x47)
- Voltage - Collector Emitter Breakdown (Max)：1000 V
- Current - Collector (Ic) (Max)：409 A
- Power - Max：959 W
- Current - Collector Cutoff (Max)：500 µA
- Input Capacitance (Cies) @ Vce：26.093 nF @ 20 V
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Overview
The NXH400N100H4Q2F2PG is a three-level Neutral Point Clamped (NPC) inverter module manufactured by onsemi. It utilizes trench field-stop IGBT technology within the Q2PACK package, measuring 93x47 mm with 42 pins. The device supports a maximum collector-emitter voltage of 1000 V and delivers a continuous collector current ranging from 298 A to 303 A at 25°C. Collector-emitter saturation voltages are specified at 1.63 V and 1.75 V. Power dissipation capabilities vary between 592 W and 731 W. The module operates within a junction temperature range of -40°C to +150°C.
Feature Summary
- Integrates trench field-stop IGBT technology for efficient power switching.
- Configured as a three-phase inverter utilizing Neutral Point Clamped architecture.
- Features an integrated NTC thermistor for precise thermal monitoring.
- Designed for base mounting within a compact Q2PACK form factor.
Applications
- Industrial motor drives
- Uninterruptible power supply systems
- Solar inverters
Procurement Notes
Verify the specific suffix against official documentation to confirm pinout and electrical characteristics. Confirm RoHS compliance status through manufacturer datasheets. Ensure thermal interface materials match the Q2PACK mounting requirements. Validate that the 1000V rating aligns with system voltage levels. Check for updated PCN notices regarding manufacturing changes.
Selection Notes
Select this module for applications requiring high current density in a compact footprint. The three-level topology reduces switching losses compared to two-level designs. Verify gate drive compatibility with the specified threshold voltages. Ensure heatsink design accommodates the maximum power dissipation values under worst-case conditions.
Part Context
This component belongs to onsemi's NXH series of high-power IGBT modules. It represents a hybrid Si/SiC solution designed for mass market applications. The Q2PACK family offers standardized dimensions for easy integration into existing power electronics platforms. It complements other high-voltage discrete semiconductors in the portfolio.
Replacement Considerations
Direct substitutes include NXH350N100H4Q2F2P1G and NXH400N100L4Q2F2SG. Verify pin compatibility and thermal resistance differences before substitution. Electrical parameters may vary slightly between variants. Consult official cross-reference guides for confirmed replacements.
