NXH400N100L4Q2F2PG

Overview

The NXH400N100L4Q2F2PG is a discrete semiconductor module manufactured by onsemi, classified under IGBT-Diode Modules. It utilizes Silicon (Si) technology and features a Q2PACK package with SMD/SMT installation style. The component operates within a temperature range of -40°C to +175°C and has a power dissipation rating of 980 W. This module is part of the NXH400N100L4Q2F2 series.

Feature Summary

• Integrated IGBT and diode configuration for power conversion
• High thermal stability supporting operation up to +175°C
• Surface-mount compatible Q2PACK design

Applications

• Power Integrated Modules (PIM)
• Energy Storage Systems (ESS)
• Industrial motor drives

Procurement Notes

Verify the specific suffix 'P' against official documentation to confirm pinout or terminal variations compared to standard variants. Ensure compatibility with surface-mount assembly processes and verify RoHS compliance status through current manufacturer declarations before integration into production designs.

Selection Notes

Select this module for applications requiring high-temperature silicon IGBT solutions in compact form factors. Evaluate thermal management requirements given the 980 W dissipation rating. Confirm that the Q2PACK footprint aligns with PCB layout constraints and that the operating voltage and current ratings meet system specifications.

Part Context

This component belongs to onsemi's NXH series of IGBT modules, specifically designed for high-power density applications. The Q2PACK family offers robust performance for industrial and automotive sectors. The 'L4' designation typically indicates specific internal topology or generation characteristics within the product line.

Replacement Considerations

Direct substitutes include NXH400N100L4Q2F2SG. Verify electrical parameters and mechanical dimensions before substitution. Cross-reference datasheets for any differences in saturation voltage or switching times between suffixes.