NXH600A100H4F5SNG

$182.58

Description：F5 1500V 600A ANPC IGBT SOLDER P
Series：-

SKU:a46d9cccdeb7 Category: IGBT Modules Brand: onsemi

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Product introduction

Product Detailed Parameters

Description：F5 1500V 600A ANPC IGBT SOLDER P
Series：-
Mfr：onsemi
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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NXH600A100H4F5SNG

Overview

The NXH600A100H4F5SNG is a power module containing high-performance IGBTs with rugged anti-parallel diodes. It features an on-board thermistor and utilizes F5 package with solder pins. The collector-emitter voltage is 1000 V, with continuous collector currents ranging from 156 A to 542 A depending on the specific transistor pair. Maximum power dissipation reaches 1357 W at TC = 80°C. Operating junction temperatures range from -40°C to 175°C, with recommended operation up to 150°C.

Feature Summary

Extremely efficient trench with field stop technology
Low switching loss reduces system power dissipation
Integrated on-board thermistor for thermal monitoring

Applications

Solar Inverter
Uninterruptible Power Supplies

Procurement Notes

Verify the complete part number including assembly site code (AT) and date code (YYWW). Confirm RoHS compliance status as indicated in official documentation. Ensure compatibility with F5 blister tray packaging specifications before ordering.

Selection Notes

Select based on required current ratings for specific legs T1-T4 versus T5-T6. Verify thermal resistance requirements against heatsink interface materials. Check gate charge parameters for driver capability matching.

Part Context

This component belongs to the F5 ANPC Inverter Power Module series by onsemi. It is designed for high-efficiency power conversion applications requiring robust switching performance and integrated thermal management capabilities within a standardized package format.