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The NXH800A100L4Q2F2S1G is a three-level ANPC Q2Pack module from onsemi, utilizing silicon trench field-stop technology. It integrates high-performance IGBTs with rugged anti-parallel diodes in a compact Q2PACK (Case 180HH) housing with solder pins. The outer IGBTs support a collector-emitter voltage of 1000 V and a continuous current of 309 A at TC = 80°C. The module features a maximum power dissipation of 714 W at TJ = 175°C, an operating junction temperature range of -40°C to +175°C, and isolation test voltage of 4000 VRMS.
Verify the specific suffix 'S1G' corresponds to the Q2PACK Case 180HH configuration with positive solder pins. Confirm RoHS compliance status and check for any product discontinuance notifications or PCN updates prior to finalizing procurement plans.
Select this module for applications requiring high current handling and low switching losses in a compact form factor. Ensure the gate drive circuit supports the specified threshold voltages and that the thermal management system can handle the 714 W power dissipation limit at the maximum junction temperature.
This component belongs to the NXH800A100L4Q2F2 series of three-level ANPC modules. It shares the same core electrical characteristics as the P1G variant but differs in terminal configuration, specifically using solder pins instead of press-fit pins for board mounting.
NXH800A100L4Q2F2P1G offers identical electrical performance but utilizes press-fit pins (Case 180HG). Verify mechanical compatibility before substitution.
The maximum operating junction temperature is 175°C.
Yes, it includes an integrated NTC thermistor with a nominal resistance of 22 kΩ at 25°C.
The isolation test voltage is 4000 VRMS for 1 second at 50 Hz.