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Product Detailed Parameters
- Description：MASS MARKET GEN3 Q2PACK NEGATIVE
- Series：-
- Mfr：onsemi
- Package：Tray
- IGBT Type：Trench Field Stop
- Configuration：Three Level Inverter
- Vce(on) (Max) @ Vge, Ic：2.3V @ 15V, 400A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：51-PIM/Q2PACK (93x47)
- Voltage - Collector Emitter Breakdown (Max)：1000 V
- Current - Collector (Ic) (Max)：309 A
- Power - Max：714 W
- Current - Collector Cutoff (Max)：20 µA
- Input Capacitance (Cies) @ Vce：49.7 nF @ 20 V
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Overview
The NXH800A100L4Q2F2S2G is a three-level ANPC Q2Pack module from onsemi, utilizing silicon IGBT technology. It features solder pins and a negative configuration (Case 180BM). The outer IGBTs (T1a, T1b, T4a, T4b) have a VCES of 1000 V and a continuous collector current of 309 A at TC = 80°C. The inner IGBTs (T2, T3) support 413 A, while neutral point IGBTs (T5, T6) support 224 A. Maximum power dissipation reaches 714 W for outer devices at TJ = 175°C. Operating junction temperature spans -40°C to +175°C.
Feature Summary
- Combines high-performance IGBTs with rugged anti-parallel diodes in a high-density integrated design.
- Utilizes extremely efficient trench field stop technology to reduce switching losses and system power dissipation.
- Features a low inductive layout and low package height for improved thermal and electrical performance.
- Includes NTC thermistors for precise temperature monitoring within the module.
Applications
- Solar inverters
- Uninterruptible Power Supply (UPS) systems
Procurement Notes
Verify the specific ordering suffix 'S2G' corresponds to the Q2PACK negative solder pin configuration (Case 180BM) as documented in the official datasheet. Confirm that the component is lead-free and halide-free before integration. Ensure compatibility with the required mounting style and verify the assembly site code if traceability is critical for the application.
Selection Notes
Select this module for applications requiring a three-level ANPC topology with high current density. Consider the thermal resistance values and maximum operating junction temperature when designing the heatsink interface. Verify that the gate drive voltage ranges and switching characteristics align with the control circuit requirements to ensure optimal performance and reliability under load conditions.
Part Context
This part belongs to the NXH800A100L4Q2F2 series of three-level ANPC modules. It shares core electrical specifications with variants like NXH800A100L4Q2F2S1G, differing primarily in the terminal configuration. The S2G suffix specifically denotes the negative solder pin version, distinguishing it from press-fit or positive pin alternatives within the same product family.
Replacement Considerations
NXH800A100L4Q2F2S1G
FAQ
What is the isolation test voltage for this module?
The isolation test voltage is 4000 VRMS for 1 second at 50 Hz.
What is the comparative tracking index (CTI) of the insulation material?
The comparative tracking index is greater than 600.
What are the nominal resistance values for the integrated NTC thermistor?
The nominal resistance is 22 kOhm at 25°C and 1504 Ohm at 100°C.
