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The NXH80T120L2Q0S2G is a silicon IGBT module manufactured by onsemi, classified under the Half Bridge configuration. It features a maximum collector-emitter voltage (VCEO) of 1.2 kV and supports a continuous collector current of 80 A at 25°C. The device exhibits a collector-emitter saturation voltage of 2.05 V and a gate-emitter leakage current of 300 nA. Power dissipation is rated at 158 W, with an operating temperature range spanning from -40°C to +150°C. The component utilizes standard pinout technology and is supplied in Tray packaging.
Verify the specific datasheet revision and RoHS compliance status directly with the manufacturer or authorized distributor before integration. Confirm that the standard pinout matches the target PCB footprint requirements. Ensure thermal management solutions align with the 158 W power dissipation rating and the specified junction temperature limits to maintain operational reliability.
Select this module when a 1.2 kV half-bridge IGBT solution with 80 A continuous current capability is required. Consider the 2.05 V saturation voltage for conduction loss calculations. Verify that the -40°C to +150°C operating range meets the environmental constraints of the intended application. Compare against other Q0PACK variants if different thermal or electrical characteristics are needed.
This part belongs to onsemi's IGBT Silicon Modules portfolio, specifically within the NXH series. It represents a standard pinout variant designed for general-purpose power electronics. The module integrates high-voltage silicon IGBTs optimized for efficiency and reliability in medium-power industrial applications.
NXH80T120L2Q0S2TG is a tray-packaged alternative within the same series. NXH80T120L3Q0S3G offers a Generation 3 Q0PACK design with solder pins and different thermal ratings.