NXV65HR51DZ2

Power Driver Modules Overview

The NXV65HR51DZ2 is a 16-lead SIP or DIP H-Bridge power module from the APM16 series, designed for LLC and phase-shifted DC-DC converters. It features an electrically isolated substrate rated at 5 kV/1 sec and complies with IEC60664-1 and IEC 60950-1 creepage and clearance standards. The module utilizes an Al2O3 DBC substrate and operates within a temperature range of -40 °C to 125 °C. Key electrical parameters include a drain-to-source breakdown voltage of 650 V, a typical on-resistance of 44 mΩ at 25 °C, and a continuous drain current of 33 A at 25 °C case temperature.

Power Driver Modules Feature Summary

• SIP or DIP H-Bridge power module configuration
• 5 kV/1 sec electrically isolated substrate
• Compact design for low total module resistance
• Module serialization for full traceability

Power Driver Modules Applications

• DC-DC converter for On-board Charger in EV
• DC-DC converter for On-board Charger in PHEV

Power Driver Modules Procurement Notes

Verify the specific ordering suffix CAB corresponds to the L-shape lead forming required for your PCB layout. Confirm that the absence of an internal snubber capacitor aligns with your circuit topology requirements. Ensure thermal management solutions accommodate the specified junction-to-case thermal resistance values under maximum load conditions.

Power Driver Modules Selection Notes

Select this component when designing high-efficiency onboard chargers requiring automotive qualification. The integrated H-bridge topology simplifies assembly and optimizes layout compared to discrete solutions. Consider the 5 kV isolation rating for safety compliance in high-voltage EV applications. Verify gate drive compatibility with the specified threshold voltage and total gate charge characteristics.

Power Driver Modules Part Context

This device belongs to the APM16 series of automotive-grade power modules manufactured by onsemi. The series targets electric and plug-in hybrid vehicle applications, emphasizing reliability and compact form factors. The NXV65HR51DZ2 variant specifically offers L-shaped leads and lacks an internal buffer capacitor, distinguishing it from other configurations in the same family.

Power Driver Modules Replacement Considerations

NXV65HR51DZ1 serves as a direct alternative with identical electrical specifications but features Y-shaped leads instead of L-shaped leads. Both parts share the same package dimensions and performance metrics, allowing for potential pin-compatible substitution if lead forming differences are accommodated in the mechanical design.