P2000DE45X168HPSA1

$6,381.61

Description：PRESS PACK IGBT
Series：-

SKU:8cfee2aac86a Category: IGBT Modules Brand: Infineon Technologies

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Product introduction

Product Detailed Parameters

Description：PRESS PACK IGBT
Series：-
Mfr：Infineon Technologies
Package：Tray
IGBT Type：-
Configuration：-
Vce(on) (Max) @ Vge, Ic：-
Input：-
NTC Thermistor：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Voltage - Collector Emitter Breakdown (Max)：-
Current - Collector (Ic) (Max)：-
Power - Max：-
Current - Collector Cutoff (Max)：-
Input Capacitance (Cies) @ Vce：-

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P2000DE45X168HPSA1

Overview

The P2000DE45X168HPSA1 is a press pack IGBT module manufactured by Infineon Technologies. It features a 4500 V collector-emitter voltage rating and a continuous collector current of 2000 A at 25 °C. The device utilizes Trench IGBT technology with an integrated freewheeling diode. Key electrical parameters include a maximum collector-emitter saturation voltage of 35 V and a gate-emitter voltage limit of ±20 V. Operating temperatures range from -40 °C to +150 °C, with a leakage current of 350 nA.

Feature Summary

Integrates advanced 4.5 kV Trench IGBT chips for high switching performance
Includes an integrated freewheeling diode within the press pack housing
Utilizes PressFIT pin installation for solderless connection to large current PCBs

Applications

Industrial motor control systems
Power supply inverters
High-power energy conversion applications

Procurement Notes

Verify component authenticity through official Infineon channels or authorized distributors. Confirm that the specific ordering suffix matches the required technical specifications. Ensure compliance with export regulations if shipping from the United States, as additional documentation may be necessary for this product category.

Selection Notes

Select this module for applications requiring robust current handling and high voltage blocking capabilities. The press pack design facilitates direct mounting without traditional wire bonding. Consider thermal management requirements due to the high power density inherent in this class of silicon modules.

Part Context

This component belongs to Infineon's press pack IGBT series, designed for chassis mount configurations. It represents a discrete solution distinct from multi-module packages like EconoPACK. The disc-shaped housing accommodates high-current industrial environments where reliability under pulse loads is critical.

Replacement Considerations

Consult official substitution lists for compatible alternatives. Verify that any replacement maintains identical voltage ratings, current capabilities, and mechanical dimensions to ensure proper fit and function in existing assemblies.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.