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PEX8624-BB50RBC F is listed in the Analog Switches - Special Purpose range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is IC PCI EXPRESS SWITCH 324FCBGA. Review the specifications below when checking this part for your BOM.
The PEX8624-BB50RBC F is a PCI Express switch integrated circuit manufactured by Broadcom Limited. It supports PCIe Gen2 specifications with a data rate of 5.0 GT/s and provides 24 lanes across 6 ports. The device is housed in a 324-FCBGA package measuring 19x19 mm. It operates within an industrial temperature range from -40°C to +85°C. The component utilizes I2C for interface control and is RoHS compliant. This part belongs to the ExpressLane series and is designed for high-performance switching applications.
This component has been officially discontinued as of June 23, 2025. Verification of current availability should be conducted through authorized distributors or secondary market suppliers. Procurement planning must account for the end-of-life status and potential supply constraints associated with obsolete semiconductor inventory.
Designers requiring active components should consider the PEX8724-CA80BC G as the manufacturer-recommended replacement. Selection criteria must include compatibility with existing PCB footprints and electrical parameters. Verify that the substitute part meets all thermal and signal integrity requirements for the target application environment.
The PEX8624 series represents Broadcom's ExpressLane family of PCIe switches. These devices are engineered for scalable connectivity in enterprise environments. The specific BB50RBC F suffix denotes the package type, speed grade, and operating temperature range defined by the manufacturer's coding system.
The PEX8724-CA80BC G is listed as the manufacturer recommended substitute. Engineers must verify pinout compatibility and firmware support before implementing this alternative in existing designs.
The PEX8624-BB50RBC F supports PCIe Gen2 specifications with a signaling rate of 5.0 GT/s.
Yes, the device is rated for an extended operating temperature range from -40°C to +85°C.
The component is supplied in a 324-ball Flip Chip Ball Grid Array (FCBGA) package with dimensions of 19x19 mm.
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