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The PI7C9X3G1632AGPCHFCE is a PCI Express packet switch manufactured by Diodes Incorporated. It operates in the HFCBGA-676 package, measuring 270mm x 270mm with a 676-ball configuration. The device supports up to 32 lanes and 16 ports, facilitating high-bandwidth data routing for complex system architectures. Designed for surface mount technology (SMD/SMT), it integrates advanced switching capabilities within a single interface IC. This component serves as a critical interconnect solution for expanding PCIe connectivity in demanding infrastructure environments.
Verify current availability status directly with authorized distributors or the manufacturer, as lead times may vary significantly. Confirm that the specific suffix matches the required package and environmental specifications for your design. Ensure compliance with RoHS directives and check for any end-of-life notices or obsolescence warnings before finalizing procurement plans.
Select this component when designing systems requiring extensive PCIe lane expansion beyond standard switch capacities. Evaluate the physical footprint constraints of the 270x270mm HFCBGA package against your PCB layout. Consider the power management features and thermal dissipation requirements associated with high-density switching operations in your target application environment.
This part belongs to the PI7C9X3G series of PCIe 3.0 packet switches from Diodes Incorporated. It represents a high-port-count variant designed for scalable infrastructure. The series generally offers flexible topology support and integrated clock buffering to reduce bill of materials complexity compared to discrete solutions.
Check for direct pin-compatible substitutes within the same family, such as other variants in the PI7C9X3G series. Verify if lower or higher lane count models meet your bandwidth requirements while maintaining package compatibility.