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The PS8501L3-E3-AX is a high-speed analog output optocoupler manufactured by Renesas Electronics. It features a single channel with a data rate of 1 Mb/s and an isolation voltage of 5000 Vrms. The device utilizes a Photo IC output type and operates within a temperature range of -55°C to +100°C. Key electrical parameters include a forward current of 25 mA, a forward voltage of 1.7 V, and an output current of 8 mA. The power dissipation is rated at 100 mW, with a reverse voltage capability of 5 V.
Verify the specific suffix E3 indicates RoHS compliance and lead-free status as per manufacturer documentation. Confirm the package type matches system requirements, noting that datasheets may list DIP or reel variations depending on the specific sub-version. Ensure the operating temperature range aligns with the final application environment constraints before procurement.
Select this component when a single-channel high-speed digital isolation solution is required with a 1 Mb/s data rate. It is appropriate for designs needing 5000 Vrms isolation between input and output sides. Consider the Photo IC output type for compatibility with downstream logic circuits. Verify thermal management capabilities given the 100 mW power dissipation rating under maximum operating conditions.
This part belongs to the NEPOC series of high-speed photocouplers from Renesas. It shares architectural similarities with the PS8501, PS8501L1, and PS8501L2 models, differing primarily in package configuration and specific electrical tolerances. The series is designed to provide cost-effective isolation solutions for various electronic applications.
Direct substitutes include other PS8501 series variants such as PS8501L1-E3-AX or PS8501L2-E3-AX, provided the package style (DIP vs SMD) matches the PCB layout. Cross-referencing with NEC/Elpida original specifications may identify equivalent legacy parts if sourcing from alternative distributors.
The typical current transfer ratio is 15% at a forward current of 16 mA.
Datasheet listings indicate availability in both DIP and reel packages; verify the specific orderable package against the schematic footprint requirements.