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The RB088BM200FNSTL is a silicon epitaxial planar Schottky barrier diode manufactured by ROHM Semiconductor. It features a cathode common dual configuration in a TO-252AA (D-Pak) surface-mount package. The device supports a repetitive peak reverse voltage of 200 V and an average rectified forward current of 10 A per diode. Key electrical parameters include a maximum forward voltage of 0.88 V at 5 A, a maximum reverse current of 7 μA at 200 V, and a peak forward surge current of 100 A. The component operates with a junction temperature up to 175 °C and utilizes ultra-low reverse leakage characteristics.
Verify the specific ordering suffix 'TL' corresponds to the required tape and reel packaging specifications before procurement. Confirm that the RoHS compliance status aligns with project requirements. Ensure the thermal design accounts for the specified junction-to-case resistance to prevent thermal runaway under load conditions.
Select this component for applications requiring high-speed switching with low forward voltage drop. The TO-252 package offers a balance between current handling capability and board space constraints. Consider the 175 °C junction temperature rating for environments where elevated operating temperatures are expected.
This part belongs to the RB088BM series of ultra-low IR Schottky barrier diodes from ROHM. The series is designed to address thermal runaway issues common in standard Schottky diodes at high temperatures through specialized blocking metal structures. The RB088BM200FNS variant serves as the base model for the FNSTL ordering designation.
The RB088BM200TL is listed as a similar level replacement with the same pinout and package.
The maximum junction temperature is 175 °C.
The device features a cathode common dual configuration.
The reflow soldering method must be used for this surface-mount product.