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S4A R6 is listed in the Single Diodes range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE STANDARD 50V 4A DO214AB. Review the specifications below when checking this part for your BOM.
The S4A R6 is a standard recovery rectifier manufactured by Taiwan Semiconductor Corporation. It features a single diode configuration housed in the DO-214AB (SMC) surface-mount package. The device supports a maximum average forward rectified current of 4 A and withstands a repetitive peak reverse voltage of 50 V. Key electrical parameters include a maximum forward voltage of 1.15 V at 4 A, a reverse leakage current of 10 uA, and a surge current rating of 100 A. It operates within a temperature range of -55°C to +150°C junction temperature.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm exact electrical tolerances and packaging specifications. Ensure compatibility with RoHS directives if required by the target application. Confirm that the component status is active for new designs, as availability may vary by region and distributor.
Select this component when a 4 A current rating and 50 V blocking voltage are required in a compact surface-mount form factor. The standard recovery time makes it appropriate for lower-frequency switching applications where ultra-fast recovery is not critical. Compare forward voltage drop and thermal resistance against alternative packages to ensure adequate heat dissipation for the specific PCB layout.
This part belongs to the standard recovery rectifier category from Taiwan Semiconductor. It utilizes silicon planar technology and is designed for high reliability in consumer and industrial electronics. The DO-214AB package provides robust mechanical stability and efficient thermal transfer compared to smaller surface-mount options.
Consult official substitution guides for equivalent parts with matching 4 A/50 V ratings and SMC packaging. Verify that any substitute maintains identical pinout configurations and thermal performance characteristics to ensure circuit compatibility without redesign.
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