SIGC14T60NCX1SA6

SIGC14T60NCX1SA6

  • Description:IGBT NPT 600V 15A DIE
  • Series:-

SKU:f7dff02f8dc9 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT NPT 600V 15A DIE
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:NPT
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):15 A
  • Current - Collector Pulsed (Icm):45 A
  • Vce(on) (Max) @ Vge, Ic:2.5V @ 15V, 15A
  • Power - Max:-
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:-
  • Td (on/off) @ 25°C:21ns/110ns
  • Test Condition:300V, 15A, 18Ohm, 15V
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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SIGC14T60NCX1SA6

Overview

The SIGC14T60NCX1SA6 is a bare IGBT chip utilizing NPT technology with a 600V collector-emitter voltage rating. It features a 15A DC collector current and a 100µm die thickness. The component operates within a junction temperature range of -55°C to +150°C. Key electrical parameters include a maximum VCE(sat) of 2.5V at 15A, a typical turn-off fall time of 25ns, and an input capacitance of 675pF.

Feature Summary

  • NPT technology for positive temperature coefficient
  • Easy paralleling capability
  • Suitable for epoxy and soft solder die bonding

Applications

  • IGBT Modules
  • Drives

Procurement Notes

Verify the specific ordering code Q67050-A4135-A001 against the required suffix X1SA6. Confirm storage conditions require dry nitrogen and original containers. Ensure handling procedures account for ESD sensitivity per MIL-STD-883 standards.

Selection Notes

Select this chip for applications requiring easy paralleling and robust thermal characteristics. Consider the 100µm thickness and sawn-on-foil packaging for module integration. Evaluate thermal management requirements based on the specified operating temperature limits.

Part Context

This component belongs to Infineon's discrete IGBT chip portfolio designed for power module assembly. It utilizes NPT technology to ensure stable operation under varying thermal loads. The chip serves as a fundamental building block for industrial drive systems.

Replacement Considerations

Consult official documentation for direct substitutes. Verify compatibility regarding die dimensions, metallization types, and electrical ratings before considering alternative components.

SIGC14T60NCX1SA6SIGC14T60NCX1SA6

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