SIGC14T60SNCX7SA1

SIGC14T60SNCX7SA1

  • Description:IGBT NPT 600V 15A DIE
  • Series:-

SKU:321cac96dbc5 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT NPT 600V 15A DIE
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:NPT
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):15 A
  • Current - Collector Pulsed (Icm):45 A
  • Vce(on) (Max) @ Vge, Ic:2.5V @ 15V, 15A
  • Power - Max:-
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:-
  • Td (on/off) @ 25°C:31ns/261ns
  • Test Condition:400V, 15A, 21Ohm, 15V
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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SIGC14T60SNCX7SA1

Overview

The SIGC14T60SNCX7SA1 is a surface-mount NPT-type Insulated Gate Bipolar Transistor (IGBT) manufactured by Infineon Technologies. It features a 600V collector-emitter voltage rating and a continuous current capacity of 15A. Designed for high-efficiency power switching, this component utilizes advanced wafer technology to minimize conduction losses while maintaining robust thermal performance suitable for industrial applications.

Feature Summary

  • NPT-type construction for reliable blocking capabilities
  • Surface-mount die configuration for compact integration
  • Optimized for high-efficiency power conversion

Applications

  • Industrial motor drives
  • Uninterruptible power supplies (UPS)
  • High-frequency inverters

Procurement Notes

Verify the specific suffix 'CX7SA1' against official Infineon documentation to confirm exact binning or testing parameters. Ensure compatibility with existing PCB footprints designed for bare die or specialized surface-mount IGBT packages. Cross-reference datasheet revisions to validate electrical characteristics before finalizing procurement orders.

Selection Notes

Select this component when space constraints require a surface-mount solution over traditional through-hole modules. Evaluate thermal management requirements carefully as bare die implementations rely heavily on substrate heat dissipation. Confirm that the 600V rating aligns with system voltage levels and transient surge expectations.

Part Context

This part belongs to Infineon's portfolio of discrete power semiconductors tailored for modern power electronics. It represents a shift towards miniaturized packaging solutions while maintaining the reliability standards associated with Infineon's industrial-grade IGBT lines. The device supports designs aiming for higher power density in constrained form factors.

Replacement Considerations

Direct substitutes must match the 600V/15A specification and surface-mount die format. Verify pinout compatibility and thermal resistance characteristics. Consult Infineon's cross-reference tools for approved alternative part numbers within the same product family.

SIGC14T60SNCX7SA1SIGC14T60SNCX7SA1

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