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The SIGC156T60NR2C is a 600 V NPT-technology IGBT chip designed for module integration. It features a 100 µm thickness and a die size of 12.5 x 12.5 mm². The component supports a DC collector current of 200 A and a pulsed current of 600 A. Key electrical parameters include a saturation voltage of 1.7 V to 2.5 V at 200 A, an integrated gate resistor of 5 Ω, and a turn-off delay time of 285 ns. Operating junction temperatures range from -55 °C to +150 °C.
Verify the specific ordering code Q67050-A4013-A001 against official Infineon documentation to ensure correct part identification. Confirm that the component meets the required thermal properties for your assembly, as the DC collector current depends on these characteristics. Ensure proper handling procedures are followed due to electrostatic discharge sensitivity.
Select this chip for applications requiring robust short-circuit protection and easy paralleling capabilities. The NPT technology ensures reliable operation across a wide temperature range. Consider the integrated gate resistor when designing the gate drive circuitry to simplify layout and control switching behavior effectively.
This component is an IGBT chip manufactured using NPT technology by Infineon Technologies. It is intended for use in power modules rather than standalone discrete applications. The datasheet references the BSM 200 GD 60 DLC Econo Pack 3 device for further electrical context.
No public confirmed substitute part numbers are available in the provided documentation.
The maximum pulsed collector current is 600 A, limited by the maximum junction temperature.
Yes, it is classified as an Electrostatic Discharge Sensitive Device according to MIL-STD 883.
Store in the original container in dry nitrogen at an ambient temperature of 23°C for less than 6 months.