SIGC156T60NR2CX1SA2

SIGC156T60NR2CX1SA2

  • Description:IGBT NPT 600V 200A DIE
  • Series:-

SKU:79773f7f917e Category: Brand:

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Product Detailed Parameters

  • Description:IGBT NPT 600V 200A DIE
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:NPT
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):200 A
  • Current - Collector Pulsed (Icm):600 A
  • Vce(on) (Max) @ Vge, Ic:2.5V @ 15V, 200A
  • Power - Max:-
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:-
  • Td (on/off) @ 25°C:180ns/285ns
  • Test Condition:300V, 200A, 1.5Ohm, 15V
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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SIGC156T60NR2CX1SA2

Overview

The SIGC156T60NR2C is a 600 V NPT-technology IGBT chip designed for module integration. It features a 100 µm thickness and a die size of 12.5 x 12.5 mm². The component supports a DC collector current of 200 A and a pulsed current of 600 A. Key electrical parameters include a saturation voltage of 1.7 V to 2.5 V at 200 A, an integrated gate resistor of 5 Ω, and a turn-off delay time of 285 ns. Operating junction temperatures range from -55 °C to +150 °C.

Feature Summary

  • NPT technology with positive temperature coefficient
  • Short circuit proof capability
  • Integrated 5 Ω gate resistor

Applications

  • IGBT modules
  • Drives

Procurement Notes

Verify the specific ordering code Q67050-A4013-A001 against official Infineon documentation to ensure correct part identification. Confirm that the component meets the required thermal properties for your assembly, as the DC collector current depends on these characteristics. Ensure proper handling procedures are followed due to electrostatic discharge sensitivity.

Selection Notes

Select this chip for applications requiring robust short-circuit protection and easy paralleling capabilities. The NPT technology ensures reliable operation across a wide temperature range. Consider the integrated gate resistor when designing the gate drive circuitry to simplify layout and control switching behavior effectively.

Part Context

This component is an IGBT chip manufactured using NPT technology by Infineon Technologies. It is intended for use in power modules rather than standalone discrete applications. The datasheet references the BSM 200 GD 60 DLC Econo Pack 3 device for further electrical context.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.

FAQ

What is the maximum pulsed collector current?

The maximum pulsed collector current is 600 A, limited by the maximum junction temperature.

Is the device sensitive to electrostatic discharge?

Yes, it is classified as an Electrostatic Discharge Sensitive Device according to MIL-STD 883.

What is the recommended storage environment?

Store in the original container in dry nitrogen at an ambient temperature of 23°C for less than 6 months.

SIGC156T60NR2CX1SA2SIGC156T60NR2CX1SA2

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