SIGC18T60NCX1SA5

SIGC18T60NCX1SA5

  • Description:IGBT NPT 600V 20A DIE
  • Series:-

SKU:571bccf9ba00 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT NPT 600V 20A DIE
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:NPT
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):20 A
  • Current - Collector Pulsed (Icm):60 A
  • Vce(on) (Max) @ Vge, Ic:2.5V @ 15V, 20A
  • Power - Max:-
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:-
  • Td (on/off) @ 25°C:21ns/110ns
  • Test Condition:300V, 20A, 13Ohm, 15V
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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SIGC18T60NCX1SA5

Overview

The SIGC18T60NCX1SA5 is an IGBT chip manufactured by Infineon Technologies, utilizing NPT (Non-Punch-Through) technology. It features a 600V collector-emitter voltage rating and a 20A DC collector current capability at Tj=25°C. The die size measures 4.3 x 4.3 mm² with a thickness of 100µm. Key electrical parameters include a VCE(sat) of 1.7V to 2.5V at IC=20A and VGE=15V, and a gate-emitter threshold voltage ranging from 4.5V to 6.5V. Operating junction temperature spans -55°C to +150°C.

Feature Summary

  • Utilizes Non-Punch-Through (NPT) technology for robust performance
  • Features a positive temperature coefficient for safe operation
  • Designed for easy paralleling in high-power applications

Applications

  • Industrial motor drives
  • Power conversion systems
  • High-voltage switching modules

Procurement Notes

Verify the component against official Infineon datasheets to confirm technical specifications and authenticity. Ensure compliance with handling guidelines for electrostatic discharge sensitive devices. Confirm that the application environment respects the maximum operating junction temperature limits specified in the documentation.

Selection Notes

Select this chip for designs requiring 600V blocking capability and moderate current handling up to 20A. Consider the thermal properties of the assembly as they directly impact the DC collector current rating. Evaluate the need for paralleling multiple chips due to the device's positive temperature coefficient characteristics.

Part Context

This component belongs to the family of discrete IGBT chips intended for integration into larger power modules. It serves as a fundamental switching element within semiconductor solutions provided by Infineon Technologies, specifically targeting industrial and automotive power electronics sectors.

Replacement Considerations

Consult official Infineon documentation for verified substitute part numbers. Cross-reference electrical ratings and physical dimensions before implementation.

FAQ

What technology does the SIGC18T60NC utilize?

It utilizes Non-Punch-Through (NPT) technology.

What is the maximum collector-emitter voltage?

The maximum collector-emitter voltage is 600V.

Is this device suitable for paralleling?

Yes, it features a positive temperature coefficient which facilitates easy paralleling.

SIGC18T60NCX1SA5SIGC18T60NCX1SA5

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