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The SIGC18T60NCX1SA5 is an IGBT chip manufactured by Infineon Technologies, utilizing NPT (Non-Punch-Through) technology. It features a 600V collector-emitter voltage rating and a 20A DC collector current capability at Tj=25°C. The die size measures 4.3 x 4.3 mm² with a thickness of 100µm. Key electrical parameters include a VCE(sat) of 1.7V to 2.5V at IC=20A and VGE=15V, and a gate-emitter threshold voltage ranging from 4.5V to 6.5V. Operating junction temperature spans -55°C to +150°C.
Verify the component against official Infineon datasheets to confirm technical specifications and authenticity. Ensure compliance with handling guidelines for electrostatic discharge sensitive devices. Confirm that the application environment respects the maximum operating junction temperature limits specified in the documentation.
Select this chip for designs requiring 600V blocking capability and moderate current handling up to 20A. Consider the thermal properties of the assembly as they directly impact the DC collector current rating. Evaluate the need for paralleling multiple chips due to the device's positive temperature coefficient characteristics.
This component belongs to the family of discrete IGBT chips intended for integration into larger power modules. It serves as a fundamental switching element within semiconductor solutions provided by Infineon Technologies, specifically targeting industrial and automotive power electronics sectors.
Consult official Infineon documentation for verified substitute part numbers. Cross-reference electrical ratings and physical dimensions before implementation.
It utilizes Non-Punch-Through (NPT) technology.
The maximum collector-emitter voltage is 600V.
Yes, it features a positive temperature coefficient which facilitates easy paralleling.