SIGC18T60NCX7SA2

SIGC18T60NCX7SA2

  • Description:IGBT NPT 600V 20A DIE
  • Series:-

SKU:db305d2d55da Category: Brand:

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Product Detailed Parameters

  • Description:IGBT NPT 600V 20A DIE
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:NPT
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):20 A
  • Current - Collector Pulsed (Icm):60 A
  • Vce(on) (Max) @ Vge, Ic:2.5V @ 15V, 20A
  • Power - Max:-
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:-
  • Td (on/off) @ 25°C:21ns/110ns
  • Test Condition:300V, 20A, 13Ohm, 15V
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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SIGC18T60NCX7SA2

Overview

The SIGC18T60NCX7SA2 is a single NPT IGBT die manufactured by Infineon Technologies. It features a collector-emitter breakdown voltage of 600 V and utilizes TRENCHSTOP™ technology for optimized switching performance. The component is supplied in bulk packaging as a bare wafer/die, intended for integration into custom power modules or discrete assemblies.

Feature Summary

  • NPT (Non-Punch-Through) silicon structure
  • TRENCHSTOP™ gate architecture
  • High thermal robustness

Applications

  • Industrial motor drives
  • Power supply inverters
  • Custom power module assembly

Procurement Notes

Verify the specific lot date code and wafer map compatibility with your assembly process before ordering. Confirm that the bulk die format meets your pick-and-place or wire-bonding equipment specifications. Ensure proper ESD handling protocols are followed during storage and installation to prevent damage to the sensitive gate oxide layer.

Selection Notes

Select this component when a 600V blocking capability is required in a compact form factor. Consider the trade-off between the high current density of the NPT structure and the specific thermal management requirements of your target application compared to standard planar IGBTs.

Part Context

This part belongs to Infineon's portfolio of discrete semiconductor devices designed for high-power applications. It represents a foundational building block for engineers designing custom power electronics rather than a pre-packaged commercial module.

Replacement Considerations

No direct public substitute part numbers are confirmed in the provided documentation. Cross-reference with other Infineon 600V NPT dies such as the SIGC series variants based on specific current ratings and thermal resistance requirements.

SIGC18T60NCX7SA2SIGC18T60NCX7SA2

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