SIGC42T60UNX7SA1

SIGC42T60UNX7SA1

  • Description:IGBT NPT 600V 50A DIE
  • Series:-

SKU:16c9a7a56402 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IGBT NPT 600V 50A DIE
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Bulk
  • IGBT Type:NPT
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):50 A
  • Current - Collector Pulsed (Icm):150 A
  • Vce(on) (Max) @ Vge, Ic:3.15V @ 15V, 50A
  • Power - Max:-
  • Switching Energy:-
  • Input Type:Standard
  • Gate Charge:-
  • Td (on/off) @ 25°C:48ns/350ns
  • Test Condition:400V, 50A, 6.8Ohm, 15V
  • Reverse Recovery Time (trr):-
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

Download product information

SIGC42T60UNX7SA1

Overview

The SIGC42T60UNX7SA1 is a high-speed Insulated Gate Bipolar Transistor (IGBT) chip manufactured by Infineon Technologies. It features a Non-Punch-Through (NPT) design optimized for surface mount applications. The device supports a maximum collector-emitter voltage of 600 V and a continuous collector current of 50 A under specified test conditions. It operates within a junction temperature range of -55°C to 150°C. The component utilizes a standard input type configuration, ensuring compatibility with conventional gate drive circuits in power electronics systems.

Feature Summary

  • High-speed switching capability suitable for demanding power conversion environments
  • Robust NPT technology providing reliable performance across wide operating temperatures
  • Surface mount die format designed for efficient integration into compact PCB layouts

Applications

  • Industrial motor drives requiring high-power density solutions
  • Uninterruptible Power Supplies (UPS) systems
  • High-frequency inverters and converters

Procurement Notes

Verify the specific datasheet revision and application notes provided by Infineon Technologies before integration. Confirm that the surface mount die form factor aligns with your thermal management strategy and PCB assembly capabilities. Ensure gate drive parameters match the standard input requirements to prevent device stress during operation.

Selection Notes

Select this component when a 600V rated IGBT with 50A current capacity is required in a surface mount configuration. Consider the -55°C to 150°C operating range for harsh environment applications. Evaluate thermal resistance characteristics against your heatsinking solution to maintain junction temperatures within safe limits during high-load operations.

Part Context

This part belongs to Infineon's portfolio of discrete semiconductor devices, specifically targeting high-performance power electronics. As an IGBT chip, it combines the easy gate drive of MOSFETs with the high-current handling of bipolar transistors. The SIGC42T60UNX7SA1 variant represents a specialized surface mount solution within the broader 600V IGBT family.

Replacement Considerations

Cross-reference with other Infineon 600V NPT IGBT chips offering similar current ratings and surface mount packages. Verify electrical parameters such as switching times and saturation voltage to ensure functional equivalence in existing designs.

SIGC42T60UNX7SA1SIGC42T60UNX7SA1

Click on the inquiry