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The Vishay Siliconix SiSF20DN-T1-GE3 is a common-drain dual N-channel MOSFET utilizing TrenchFET Gen IV technology. It features a PowerPAK 1212-8SCD package with an integrated common drain for optimized bi-directional current flow. The device supports a drain-source voltage of 60 V and delivers a continuous source current of 52 A at TC = 25 °C. On-state resistance (RS1S2(on)) is maximized at 0.0130 Ω at VGS = 10 V and 0.0185 Ω at VGS = 4.5 V. Total gate charge is typically 10.2 nC at VGS = 4.5 V, with a maximum junction temperature rating of +150 °C.
Verify the specific ordering suffix to ensure compliance with lead-free and halogen-free material requirements as documented in the datasheet. Confirm that the component matches the PowerPAK 1212-8SCD package dimensions and pinout configuration required by the target PCB land pattern. Validate thermal management strategies against the specified junction-to-case and junction-to-ambient thermal resistance ratings.
Select this component when a compact solution for high-current bi-directional switching is required. The common-drain design simplifies layout compared to discrete dual configurations. Ensure the application gate drive voltage aligns with the specified thresholds for optimal on-resistance performance. Evaluate thermal dissipation capabilities based on the intended operating ambient temperature and board copper area.
This part belongs to the Vishay Siliconix SiSF series of power MOSFETs. It utilizes the PowerPAK 1212-8SCD package, which is specifically designed for applications requiring low profile and high thermal efficiency. The common-drain configuration distinguishes it from standard single or dual MOSFETs by integrating the drains together.
Publicly confirmed substitute part numbers are not available in the provided documentation.