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The SiZF920DT-T1-GE3 is a dual N-channel 30 V (D-S) MOSFET with an integrated Schottky diode, utilizing TrenchFET Gen IV technology. Channel-1 features a maximum RDS(on) of 3.07 mΩ at VGS = 10 V and a continuous drain current of 76 A at TC = 25 °C. Channel-2 offers a lower RDS(on) of 1.05 mΩ at VGS = 10 V with a continuous drain current of 197 A at TC = 25 °C. The device operates within a junction temperature range of -55 to +150 °C and is housed in a leadless PowerPAIR 6 x 5F package.
Verify the specific ordering suffix against official Vishay Siliconix documentation to confirm compliance attributes such as halogen-free status and RoHS directives. Confirm that the PowerPAIR package orientation matches the target PCB footprint design. Validate all electrical parameters directly from the manufacturer's datasheet prior to finalizing procurement specifications.
Evaluate the distinct electrical profiles of the two channels; Channel-2 provides significantly higher current capacity and lower on-resistance compared to Channel-1. Ensure the gate drive voltage aligns with the specified thresholds for optimal RDS(on) performance. Consider the thermal resistance ratings when designing the heat dissipation strategy for the leadless package configuration.
This component belongs to the SiZF series of dual N-channel MOSFETs manufactured by Vishay Siliconix. It utilizes the proprietary TrenchFET Gen IV technology to achieve superior power density and switching efficiency. The integration of a Schottky diode distinguishes it from standard dual MOSFET arrays, making it suitable for applications requiring fast body-diode replacement.
SiZF918BDT-T1-GE3