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SMP1345-087LF is listed in the RF Diode range at ChipApex. The manufacturer field lists Skyworks Solutions Inc.. Its product description is RF DIODE PIN 500MW 2QFN. Review the specifications below when checking this part for your BOM.
The SMP1345-087LF is a surface mountable PIN diode designed for RF switch and attenuator circuits. It features a maximum series resistance of 2 Ω at 10 mA forward current and a maximum total capacitance of 0.2 pF at 5 V reverse voltage. The device has a dissipated power rating of 0.5 W, enabling it to handle up to 40 W continuous wave and 440 W peak power in transmit/receive configurations. Operating temperature ranges from -55 °C to +150 °C, with a junction temperature limit of +175 °C. It utilizes a QFN (2 x 2 mm) package.
Verify the specific part number against official Skyworks documentation before procurement. Confirm that the component meets all absolute maximum ratings, including forward current and thermal limits. Ensure proper ESD protection during handling and storage. Check for any recent product change notifications or discontinuation notices directly from the manufacturer.
Select this component when low insertion loss and high isolation are required in RF applications. Consider the 0.5 W power dissipation capability for high-power switching scenarios. Verify compatibility with standard lead-free soldering processes due to its MSL1 rating. Evaluate PCB layout requirements based on the provided footprint dimensions.
The SMP1345-087LF belongs to the SMP1345 series of plastic packaged silicon PIN diodes manufactured by Skyworks Solutions. This series is engineered for high-volume applications requiring fast switching speeds and low parasitic effects. The device is suitable for use in wireless infrastructure and communication systems where reliable RF performance is critical.
Consult Skyworks application notes for potential substitute components. Verify electrical specifications and package dimensions match the original design requirements. Ensure any replacement part meets the same thermal and power handling capabilities.
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