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STB23N80K5 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is MOSFET N-CH 800V 16A D2PAK. Review the specifications below when checking this part for your BOM.
The STB23N80K5 is an N-channel Power MOSFET utilizing MDmesh K5 technology, housed in a D2PAK-3 (TO-263-3) package. It features a drain-source breakdown voltage of 800 V and a continuous drain current of 16 A. The typical on-resistance is 0.23 Ohms, with a maximum specified at 280 mOhms. Gate-source voltage limits are ±30 V, and the threshold voltage is 4 V. Total gate charge is 33 nC. The device supports a power dissipation of 190 W, operates between -55°C and +150°C, and exhibits rise and fall times of 9 ns.
Verify the specific ordering suffix to confirm the exact packaging configuration, such as reel, cut tape, or MouseReel, as these affect handling but not electrical function. Confirm RoHS compliance status through official documentation before integration. Ensure the procurement channel sources directly from authorized distributors to guarantee component authenticity and traceability.
Select this component for designs requiring high voltage blocking capability combined with low conduction losses. The D2PAK package offers a balance of thermal performance and surface-mount convenience. Consider the 800 V rating for robustness against voltage transients in industrial environments. Evaluate the 16 A current capacity against peak load requirements to ensure adequate safety margins.
This part belongs to the MDmesh K5 family of superjunction MOSFETs from STMicroelectronics. The series is engineered for superior power density and high efficiency. Other members include STL2N80K5 and STF4N80K5, which share the underlying technology but differ in current ratings and package types.
Direct substitutes within the same family include STL2N80K5 and STF4N80K5. These alternatives offer similar electrical characteristics but vary in current handling and physical footprint. Verify pin compatibility and thermal resistance when swapping packages.
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