SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The STGP30NC60W is a 600 V, 30 A ultra fast IGBT manufactured by STMicroelectronics. It utilizes the PowerMESH™ process to balance switching performance and low on-state behavior. The device features a lower CRES/CIES ratio to prevent cross-conduction susceptibility. It operates with a collector-emitter saturation voltage of 2.5 V max at 20 A and 15 V gate drive. Switching losses are 486 µJ total at 25 °C and 801 µJ at 125 °C under standard test conditions. The component is housed in a TO-220 package for through-hole mounting.
Verify the specific ordering suffix against the manufacturer's current datasheet revision history. Confirm that the TO-220 package variant matches the required mechanical footprint and lead configuration for the target PCB layout. Ensure environmental compliance requirements align with the ECOPACK specifications provided in the official documentation.
Select this component for designs requiring high frequency operation up to 1 MHz. Evaluate thermal management based on the junction-to-ambient resistance of 62.5 °C/W for the TO-220 package. Consider the turn-off latching current limit of 150 A when designing protection circuits for short-circuit scenarios.
This part belongs to the STGB/STGP/STGW30NC60W family sharing identical electrical characteristics. The STGP30NC60W specifically denotes the TO-220 packaging option within this series. Other variants include the D²PAK and TO-247 packages for different thermal and mechanical integration needs.
Direct substitutes within the same electrical specification family include STGB30NC60WT4 and STGW30NC60W. Verify pinout compatibility if replacing with devices from other manufacturers offering similar 600 V / 30 A ratings.