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The STGWA80H65DFBAG is an automotive-grade IGBT from the HB series, utilizing a trench gate field-stop structure. It features a 650 V collector-emitter voltage and an 80 A continuous collector current at 100 °C case temperature. The device operates with a maximum junction temperature of 175 °C and includes a co-packaged antiparallel diode. Key electrical parameters include a typical VCE(sat) of 1.65 V at 80 A, a total power dissipation of 535 W at 25 °C, and a thermal resistance (junction-to-case) of 0.28 °C/W for the IGBT. It is housed in a TO-247 long leads package.
Verify component authenticity by checking the marking code G80H65DFBAG against the datasheet specifications. Confirm the package type is TO-247 long leads and ensure the ordering suffix matches the required automotive grade qualification. Cross-reference the document revision DS14160 Rev 1 to guarantee technical data alignment.
Select this component for applications requiring high efficiency in frequency converters where switching losses must be minimized. The tight parameter distribution supports safer parallel operation. Ensure the design accommodates the 175 °C maximum junction temperature and utilizes the Kelvin pin configuration if available in the specific PCB layout variant.
This part belongs to the HB series of IGBTs developed using advanced proprietary trench gate field-stop technology. It represents an evolution in balancing conduction and switching losses to maximize converter efficiency. The device is specifically engineered for demanding automotive environments requiring robust performance under high thermal stress.
Direct substitutes within the same family include the STGW80H65DFB-4. Verify compatibility regarding package dimensions and electrical characteristics before substitution.
The maximum operating junction temperature is 175 °C.
Yes, the slightly positive VCE(sat) temperature coefficient and tight parameter distribution result in safer paralleling operation.
The typical VCE(sat) is 1.65 V at IC = 80 A.