T8F81C2

Field Programmable Gate Array Overview

The Efinix T8F81C2 is a Field Programmable Gate Array (FPGA) belonging to the Trion family, manufactured using Quantum architecture. It features 7384 logic units and provides 55 input/output terminals. The device operates at supply voltages of 1.05 V and 1.15 V. It is housed in an 81-ball FineLine BGA package designed for surface-mount installation.

Field Programmable Gate Array Feature Summary

• Quantum architecture providing reconfigurable logic cells for both logic resources and signal routing
• Integration of embedded memory modules and DSP/multiplier blocks within a compact footprint
• Support for configuration via USB interface using Efinity software

Field Programmable Gate Array Applications

• Evaluation and development using the Efinix Xyloni Development Kit
• Prototyping designs requiring small form factor FPGA solutions
• Implementation of RISC-V based systems on the Xyloni board

Field Programmable Gate Array Procurement Notes

Verify the specific ordering suffix against official Efinix documentation to ensure correct package type and temperature grade. Confirm that the component matches the Trion T8 series specifications before integration into design files.

Field Programmable Gate Array Selection Notes

Select this component when a low-density FPGA with embedded DSP capabilities is required. Ensure the design fits within the 7384 logic unit limit and utilizes the available I/O count. Verify voltage requirements align with the 1.05 V and 1.15 V operating parameters.

Field Programmable Gate Array Part Context

This part is the core programmable element of the Efinix Xyloni Development Kit. It serves as the primary processing unit for evaluation boards, enabling users to test Quantum architecture features and develop designs using the provided FTDI interface components.

Field Programmable Gate Array Replacement Considerations

Consult Efinix documentation for direct substitutes within the Trion family. Verify pin compatibility and logic density requirements before considering alternative packages or higher-density models.