TC74HC574APF

Flip Flops Overview

The TC74HC574APF is an octal D-type flip-flop with 3-state outputs manufactured by Toshiba Semiconductor and Storage. It belongs to the HC/UH series of high-speed CMOS logic devices. The component features a non-inverting output configuration and is housed in a 20-pin Small Outline Package (SOIC). It operates within a supply voltage range of 2 V to 6 V and supports a maximum operating frequency of 24 MHz at nominal supply. The device is designed for through-hole or surface-mount applications depending on the specific suffix, with the APF variant typically associated with SOIC packaging in distributor listings.

Flip Flops Feature Summary

• Octal D-type flip-flop architecture with true (non-inverting) outputs
• Three-state output capability for bus-oriented memory operations
• Controlled by clock input and output enable input for data latching
• Integrated protection circuits against static discharge and transient excess voltage

Flip Flops Applications

• Bus driver and transceiver circuits
• Parallel-to-serial data conversion systems
• Memory register implementations
• I/O port expansion in microcontroller interfaces

Flip Flops Procurement Notes

Verify the exact package type and marking code against the manufacturer's official datasheet, as distributor listings may conflate AP and AF suffixes. Confirm RoHS compliance status and lead times directly with authorized distributors. Ensure the ordering suffix matches the required tape-and-reel or tube packaging format specified in the final product documentation.

Flip Flops Selection Notes

Select this component when an octal D-type flip-flop with three-state outputs is required for high-speed CMOS logic applications. It offers performance comparable to LSTTL while maintaining low power dissipation. Consider the 2 V to 6 V operating range and 24 MHz maximum frequency for system timing requirements. Ensure the 20-pin SOIC footprint fits the PCB layout constraints.

Flip Flops Part Context

This part is part of the TC74HC574A family, which includes both inverting (TC74HC564A) and non-inverting (TC74HC574A) variants. The 'AP' suffix typically denotes a plastic DIP package, while 'AF' denotes a small outline package. Distributor data often lists 'APF' in conjunction with SOIC specifications, indicating a potential listing inconsistency that requires verification against the primary datasheet.

Flip Flops Replacement Considerations

Compatible substitutes include the TC74HC574AF for alternative packaging within the same Toshiba family. Cross-manufacturer equivalents such as the MC74VHC574 from onsemi offer similar functionality but may differ in voltage ranges and pinout compatibility. Verify electrical characteristics and mechanical dimensions before substitution.