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THS4502IDGN is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC OPAMP DIFF 1 CIRCUIT 8HVSSOP. Review the specifications below when checking this part for your BOM.
The THS4502IDGN is a high-speed fully differential amplifier from Texas Instruments, housed in an 8-pin MSOP PowerPAD package. It features a bandwidth of 370 MHz and a slew rate of 2800 V/µs. The device supports a wide supply voltage range including ±5 V, ±12 V, and 15 V single-ended operation. Key electrical characteristics include a common-mode rejection ratio (CMRR) of 80 dB and a third-order intermodulation distortion (IMD3) of -95 dBc at 30 MHz. It includes power-down capability with a quiescent current of 1 mA in the disabled state.
Verify the specific suffix IDGN corresponds to the industrial temperature range (-40°C to +85°C) and the MSOP PowerPAD package configuration. Confirm that the ordering part number matches the required tape-and-reel or tube packaging quantity specified by the manufacturer. Ensure thermal management design accounts for the PowerPAD heatsink requirement to prevent oscillation above 60°C junction temperature.
Select this component for applications requiring high-speed signal conversion with low distortion. Compare against the THS4503 if power-down functionality is not needed. Consider the THS4501 for designs requiring rail-to-rail input/output capabilities. Evaluate thermal dissipation requirements carefully due to the sensitivity of the device to die temperatures exceeding 60°C.
The THS4502 belongs to the THS450x family of wideband, low-distortion fully differential amplifiers. It shares performance metrics with the THS4503 but adds power-down control via the PD pin. This family is designed to drive high-speed ADCs and support wireless infrastructure applications where signal integrity and dynamic range are critical.
THS4503IDGN is the direct functional substitute without power-down capability. THS4501IDGN offers similar speed but with rail-to-rail I/O. Verify pin compatibility and thermal characteristics before substitution.
The device may exhibit low-level oscillation if the die temperature exceeds +60°C. Designers must ensure adequate thermal management to keep the junction temperature below this threshold.
In the power-down state, the input impedance changes to approximately 50 Ω || 1 kΩ || pF, differing from the typical 10^7 Ω || 1 Ω || pF in normal operation.
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