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Product Detailed Parameters
- Description：OPTOISO 3.75KV 1CH TRANS 6-MFSOP
- Series：-
- Mfr：Toshiba Semiconductor and Storage
- Package：Tape & Reel (TR)
- Number of Channels：1
- Voltage - Isolation：3750Vrms
- Current Transfer Ratio (Min)：100% @ 1mA
- Current Transfer Ratio (Max)：1200% @ 1mA
- Turn On / Turn Off Time (Typ)：10µs, 8µs
- Rise / Fall Time (Typ)：8µs, 8µs
- Input Type：AC, DC
- Output Type：Transistor
- Voltage - Output (Max)：80V
- Current - Output / Channel：50mA
- Voltage - Forward (Vf) (Typ)：1.15V
- Current - DC Forward (If) (Max)：50 mA
- Vce Saturation (Max)：400mV
- Operating Temperature：-55°C ~ 100°C
- Mounting Type：Surface Mount
- Package / Case：6-SMD (4 Leads), Gull Wing
- Supplier Device Package：6-MFSOP, 4 Lead
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Overview
The TLP126TPRF is a single-channel optocoupler manufactured by Toshiba Semiconductor and Storage, housed in a compact 6-MFSOP package with four exposed leads. It integrates a Gallium Arsenide infrared emitting diode with a phototransistor output, providing an isolation voltage of 3750Vrms. The device supports AC or DC input signals with a maximum forward current of 50 mA and typical forward voltage of 1.15 V. It delivers a collector-emitter saturation voltage of up to 400 mV at 50 mA output current and operates within a temperature range of -55°C to 100°C.
Feature Summary
- Integrates a GaAs infrared LED with a high-gain phototransistor for efficient signal transmission across isolation barriers.
- Features a specialized 6-MFSOP surface-mount package designed to enhance thermal dissipation through exposed metal pads.
- Includes internal structural shielding to provide high immunity against common-mode transient noise interference.
Applications
- Industrial inverter gate driver circuits
- Plasma display panel (PDP) interface logic
- Microcomputer system I/O isolation
Procurement Notes
Verify the specific suffix 'TPRF' to confirm the tape-and-reel packaging configuration and lead-free status. Confirm that the component meets RoHS directives and EAR99 export classification requirements. Ensure the ordering quantity aligns with the manufacturer's standard reel size specifications.
Selection Notes
Select this component when a robust surface-mount solution is required for applications demanding high common-mode transient immunity. The exposed pad design makes it suitable for environments where effective heat removal from the isolation barrier is critical for maintaining performance stability.
Part Context
This part belongs to the TLP126 series, which utilizes a unique structure combining a GaAs LED and a phototransistor with an integrated Faraday shield. This architecture distinguishes it from standard optocouplers by offering superior resistance to rapid voltage changes on the isolation boundary.
Replacement Considerations
Toshiba Semiconductor and Storage TLP182(TPL,E) is a documented alternative within the same product family.
FAQ
What is the mechanism behind the high common-mode transient immunity?
The device incorporates an internal Faraday shield between the infrared LED and the phototransistor, which effectively blocks capacitive coupling of transient noise.
How does the package design influence thermal management?
The 6-MFSOP package includes exposed metal pads on the bottom, allowing direct soldering to the PCB copper pour to facilitate efficient heat dissipation from the chip.
