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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The TSE2004GB2B0NCG8/M is a board-mount temperature sensor designed for DDR4 memory modules. It complies with the JEDEC TSE2004av device specification (JEDEC standard No. 21-C Section 4.1.6). The component integrates a temperature sensor and 512 bytes of serial EEPROM. It operates on a supply voltage range of 2.2V to 3.6V and functions within an operating temperature range of -40°C to +125°C. The output interface supports I2C/SMBus communication protocols.
Verify that the specific suffix /M matches the required tape-and-reel packaging configuration, as this affects handling and assembly compatibility. Confirm RoHS compliance status through official Renesas documentation prior to procurement. Ensure the ordering part number aligns exactly with the intended package variant to avoid integration errors during manufacturing.
Select this component when designing DDR4 memory subsystems requiring standardized thermal management solutions. The integrated EEPROM allows for storing calibration data or manufacturer information directly on the module. Verify that the host controller supports the required I2C/SMBus protocol speeds and voltage levels compatible with the 2.2V to 3.6V supply range specified for this sensor.
This part belongs to Renesas' portfolio of board-mount temperature sensors tailored for high-speed memory applications. It addresses the need for precise thermal monitoring in DDR4 architectures where overheating can impact performance and reliability. The inclusion of non-volatile memory enables enhanced system diagnostics and traceability within complex electronic assemblies.
Direct substitutes must adhere to the JEDEC TSE2004av specification to ensure mechanical and electrical compatibility with DDR4 sockets. Verify pinout alignment and interface protocol support before considering alternative components from other manufacturers.