TSE2004GB2B0NCG8

$3.12

Description：TEMPERATURE SENSOR FOR DDR4
Series：-
Mfr：Renesas Electronics Corporation
Package：Tape & Reel (TR),Cut Tape (CT)

SKU:a4ecba6e6faa Category: Thermal Management Brand: Renesas Electronics Corporation

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Product introduction

Product Detailed Parameters

Description：TEMPERATURE SENSOR FOR DDR4
Series：-
Mfr：Renesas Electronics Corporation
Package：Tape & Reel (TR),Cut Tape (CT)
Function：Temp Monitoring System (Sensor)
Sensor Type：Internal
Sensing Temperature：-
Accuracy：±2°C
Topology：ADC (Sigma Delta), Control Logic, Register Bank
Output Type：I2C/SMBus
Output Alarm：No
Output Fan：No
Voltage - Supply：2.2V ~ 3.6V
Operating Temperature：-40°C ~ 125°C
Grade：-
Qualification：-
Mounting Type：Surface Mount
Package / Case：8-WFDFN Exposed Pad
Supplier Device Package：8-VFQFPN (2x3)

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TSE2004GB2B0NCG8

Overview

The TSE2004GB2B0NCG8 is a digital temperature sensor with integrated serial EEPROM designed for DDR4 memory modules. It complies with the JEDEC TSE2004av Device Specification (JEDEC standard No. 21-C Section 4.1.6). The device features an operating temperature range of -40°C to 125°C and operates on a supply voltage of 2.2V to 3.6V. It provides high accuracy up to ±0.5°C and communicates via I2C/SMBus interface.

Feature Summary

Compliant with JEDEC TSE2004av specification for DDR4 applications
Integrates temperature sensing with 512-byte serial EEPROM
Delivers high measurement accuracy for critical system monitoring

Applications

DDR4 memory module temperature monitoring
System thermal management in computing platforms
SPD (Serial Presence Detect) data storage

Procurement Notes

Verify component authenticity through authorized Renesas distributors or certified partners. Confirm package integrity and pin alignment against the official datasheet specifications. Ensure the part number suffix matches the required configuration. Request batch-specific documentation to validate compliance with current manufacturing standards before integration into production systems.

Selection Notes

Select this component when designing DDR4 memory subsystems requiring precise thermal tracking alongside non-volatile data storage. The integrated EEPROM allows for storing SPD information, reducing external component count. Ensure the design supports the 2.2V to 3.6V supply range and I2C/SMBus communication protocols for seamless integration with host controllers.

Part Context

This sensor belongs to the TSE2004 family of digital temperature sensors specifically engineered for memory applications. It addresses the need for accurate thermal monitoring in high-density computing environments where heat dissipation is critical for maintaining signal integrity and system stability in DDR4 architectures.