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The TSM110NB04LDCR RLG is a dual N-channel power MOSFET manufactured by Taiwan Semiconductor. It features a PDFN56 Dual package and operates with a drain-source voltage of 40V. The device supports a continuous drain current of 10A at ambient temperature and 48A at case temperature, with a maximum on-resistance of 11mΩ at VGS=10V. Total gate charge is 23nC at VGS=10V. It includes an integrated body diode with a reverse recovery time of 15ns. The component is qualified under AEC-Q101 standards and functions within a junction temperature range of -55°C to +150°C.
Verify the specific ordering code TSM110NB04LDCR RLG against official Taiwan Semiconductor documentation to confirm package type and packing quantity. Ensure compliance with RoHS and REACH requirements as stated in the datasheet. Confirm moisture sensitivity level (MSL 1) handling procedures during assembly.
Select this component for applications requiring low conduction losses and fast switching speeds in a compact surface-mount footprint. Consider the thermal resistance values when designing heat dissipation strategies. Verify that the gate drive voltage meets the logic level requirements for optimal performance.
This part belongs to the TSM110 series of dual N-channel MOSFETs from Taiwan Semiconductor. It is designed for high-efficiency power management applications where space constraints and thermal performance are critical factors.
Consult official substitution lists or cross-reference tools provided by Taiwan Semiconductor for verified alternatives. Ensure any replacement matches the electrical specifications and package dimensions.
The maximum pulsed drain current (IDM) is 192A.
Yes, the TSM110NB04LDCR is AEC-Q101 qualified.
The typical gate threshold voltage (VGS(TH)) is 1.6V at ID=250µA.