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The TSM150NB04LDCR RLG is a dual N-channel power MOSFET manufactured by Taiwan Semiconductor. It features a PDFN56 Dual package and operates with a drain-source voltage of 40V. The device supports a continuous drain current of 37A at case temperature of 25°C, with a maximum on-resistance of 15mΩ at VGS=10V and 19mΩ at VGS=4.5V. Total gate charge is 18nC at VGS=10V. Thermal resistance from junction to case is 3.1°C/W. Operating junction temperature ranges from -55°C to +150°C.
Verify the component against the official datasheet version A2001 to ensure technical compliance. Confirm that the PDFN56 Dual package matches the required footprint dimensions and pad layout. Check RoHS compliance and halogen-free status according to IEC 61249-2-21 standards before integration into the final assembly process.
Select this component when a dual N-channel configuration is required within a compact surface-mount form factor. The logic-level threshold allows direct driving from standard logic interfaces. Ensure the thermal design accommodates the specified junction-to-case resistance for the intended power dissipation levels in the target application environment.
This part belongs to the TSM150NB04 series of dual N-channel power MOSFETs. It utilizes the PDFN56 Dual package, which provides a low-profile solution suitable for space-constrained designs. The device is designed for general-purpose power switching applications requiring high efficiency and robust performance under varying load conditions.
Direct substitutes must match the 40V rating, dual N-channel topology, and PDFN56 Dual package outline. Verify pinout compatibility and thermal characteristics to ensure seamless integration without redesigning the PCB layout or driver circuitry.
The maximum continuous drain current is 37A at a case temperature of 25°C.
The provided datasheet does not list AEC-Q101 qualification for this specific part number.
The typical gate threshold voltage is 1.7V, measured at VGS = VDS and ID = 250µA.