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The TSM300NB06LDCR RLG is a dual N-Channel Power MOSFET manufactured by Taiwan Semiconductor Corporation. It features a PDFN56 Dual package and operates with a Drain-Source Voltage (VDS) of 60 V. The device supports a continuous drain current of 24 A at case temperature (TC = 25°C) and 5 A at ambient temperature (TA = 25°C). Its maximum on-state resistance (RDS(on)) is 30 mΩ at VGS = 10V and 39 mΩ at VGS = 4.5V. Total gate charge (Qg) is 17 nC at VGS = 10V and 9 nC at VGS = 4.5V. The component is rated for an operating junction temperature range of -55 to +150 °C.
Verify the specific ordering code TSM300NB06LDCR RLG against official Taiwan Semiconductor documentation to confirm the PDFN56 Dual package and 2,500 pieces per reel packing format. Ensure that the requested components match the version A2004 datasheet specifications regarding electrical limits and thermal performance before finalizing procurement orders.
Select this component when a dual N-Channel MOSFET with a 60 V rating and low RDS(on) is required for compact surface-mount designs. Consider the 24 A continuous drain current capability at TC = 25°C and the 30 mΩ maximum resistance at VGS = 10V for efficient power management. Verify that the system's thermal design can accommodate the specified junction-to-case thermal resistance of 3.1 °C/W.
This part belongs to the TSM300 series of dual N-Channel Power MOSFETs from Taiwan Semiconductor. It utilizes the PDFN56 Dual package, which provides a compact footprint suitable for high-density PCB layouts. The device is engineered for automotive-grade reliability, featuring 100% UIS and Rg testing as documented in the manufacturer's specifications.
Consult official Taiwan Semiconductor cross-reference lists or distributor databases for verified substitute part numbers. Do not assume functional equivalence based solely on matching voltage or current ratings without verifying pinout compatibility and thermal characteristics.