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UJA1079ATW/3V3/1J is listed in the Specialized range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC INTFACE SPECIALIZED 32HTSSOP. Review the specifications below when checking this part for your BOM.
The UJA1079ATW/3V3/1J is a LIN core System Basis Chip (SBC) from NXP Semiconductors designed for automotive Electronic Control Units (ECUs). It integrates a LIN transceiver compliant with LIN 2.2A and SAE J2602, a scalable 3.3 V voltage regulator delivering up to 250 mA, an advanced independent watchdog, and a full-duplex Serial Peripheral Interface (SPI). The device features two local wake-up input ports and a limp home output port. It operates within a 6.1 mm × 11 mm HTSSOP32 package.
Verify the specific ordering suffix against the manufacturer's current documentation to confirm the integrated voltage regulator output level and presence of the watchdog feature. Confirm that the HTSSOP32 package type matches the design requirements. Ensure compliance with RoHS and dark green directives is validated through official datasheets before procurement.
Select this component when a dedicated LIN interface with integrated power management and system supervision is required. The 3.3 V regulator version is suitable for microcontrollers requiring that specific supply voltage. Consider the external PNP transistor option if higher current capability or improved thermal distribution across the PCB is necessary for the application.
The UJA1079A series replaces discrete components commonly found in ECUs by combining a LIN transceiver, voltage regulator, and watchdog into one chip. This integration supports networking applications for controlling power and sensor peripherals using LIN as a local sub-bus. The device ensures controlled startup behavior and offers detailed status reporting at the system and subsystem levels.
Check the UJA1079TW/3V3,118 variant for potential substitution. Verify compatibility regarding the voltage regulator output and the inclusion of the watchdog function. Ensure pinout and package dimensions remain identical to avoid redesigning the printed circuit board layout.
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