Configuration PROMs For FPGAs XC1701LPDG8C product image

XC1701LPDG8C

$10.36
  • Description:IC PROM SER CONFIG 1M 3.3V 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube

SKU:7a936111f78b Category: Brand:

  
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XC1701LPDG8C is listed in the Configuration PROMs For FPGAs range at ChipApex. The manufacturer field lists AMD. Its product description is IC PROM SER CONFIG 1M 3.3V 8-DIP. Review the specifications below when checking this part for your BOM.

Configuration PROMs For FPGAs specifications for XC1701LPDG8C

  • Description:IC PROM SER CONFIG 1M 3.3V 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube
  • Programmable Type:OTP
  • Memory Size:1Mb
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Supplier Device Package:8-PDIP

Configuration PROMs For FPGAs datasheet and documents for XC1701LPDG8C

XC1701LPDG8C

Configuration PROMs For FPGAs Overview

The XC1701LPDG8C is a 1-Mbit One-Time Programmable (OTP) configuration PROM manufactured by AMD Xilinx. It operates within a supply voltage range of 3V to 3.6V and is housed in an 8-DIP package. This serial configuration device is designed for programming the configuration memory of compatible Xilinx Field-Programmable Gate Arrays (FPGAs). The component provides non-volatile storage for system initialization data, ensuring reliable startup sequences for embedded logic designs.

Configuration PROMs For FPGAs Feature Summary

  • Provides 1-Mbit non-volatile storage capacity for FPGA configuration data
  • Supports standard serial interface protocols for program loading
  • Operates reliably within a 3V to 3.6V power supply range
  • Utilizes an 8-pin DIP package for through-hole mounting applications

Configuration PROMs For FPGAs Applications

  • Configuration of legacy Xilinx Spartan and Virtex FPGAs
  • Embedded systems requiring persistent boot data storage
  • Industrial control units with fixed logic configurations
  • Telecommunications equipment initialization modules

Configuration PROMs For FPGAs Procurement Notes

Verify component authenticity carefully as this part is listed as obsolete or discontinued by major distributors. Check manufacturing date codes and packaging integrity upon receipt. Ensure compatibility with target FPGA family before deployment, as OTP devices cannot be reprogrammed once written. Confirm voltage specifications match system design requirements strictly.

Configuration PROMs For FPGAs Selection Notes

Select this component only when designing systems using older Xilinx FPGA families that require external serial configuration. Consider the one-time programmable nature of the device; errors in programming are irreversible. Evaluate mechanical constraints regarding the 8-DIP package size against available PCB real estate. Assess long-term availability risks due to the component's discontinued status.

Configuration PROMs For FPGAs Part Context

This component belongs to the AMD Xilinx XC17xx series of configuration PROMs. These devices were widely used to store bitstreams for configuring Xilinx PLDs. The LP suffix typically denotes low-power variants within the series. The DG8C identifier specifies the plastic DIP package type and temperature grade. This series represents foundational technology for FPGA deployment prior to the widespread adoption of flash-based configuration methods.

Configuration PROMs For FPGAs Replacement Considerations

Direct pin-to-pin replacements may include other XC1701 variants such as XC1701LPC8C or XC1701VDC8C, depending on required voltage and speed grades. Verify electrical characteristics and timing parameters against the specific FPGA being configured. Alternative solutions might involve using modern EEPROMs or Flash memories with appropriate level shifters if the original part is unavailable.

XC1701LPDG8CXC1701LPDG8C
$10.36
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