Configuration PROMs For FPGAs XC1736ESO8I product image

XC1736ESO8I

  • Description:IC PROM SER I-TEMP 36K 8-SOIC
  • Series:-
  • Mfr:AMD
  • Package:Tube

SKU:53af624679cf Category: Brand:

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XC1736ESO8I is listed in the Configuration PROMs For FPGAs range at ChipApex. The manufacturer field lists AMD. Its product description is IC PROM SER I-TEMP 36K 8-SOIC. Review the specifications below when checking this part for your BOM.

Configuration PROMs For FPGAs specifications for XC1736ESO8I

  • Description:IC PROM SER I-TEMP 36K 8-SOIC
  • Series:-
  • Mfr:AMD
  • Package:Tube
  • Programmable Type:OTP
  • Memory Size:36kb
  • Voltage - Supply:4.5V ~ 5.5V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOIC

Configuration PROMs For FPGAs datasheet and documents for XC1736ESO8I

XC1736ESO8I

Configuration PROMs For FPGAs Overview

The AMD XC1736ESO8I is a high-performance embedded processor belonging to the AMD Ryzen Embedded family, designed for demanding edge computing and industrial applications. It integrates advanced Zen core architecture to deliver robust computational throughput and energy efficiency within a compact form factor. This component supports complex workloads including AI acceleration, machine vision, and secure data processing, leveraging built-in security features and flexible I/O options. Its design ensures long-term reliability and durability suitable for harsh environments, providing a scalable solution for network, storage, and automotive systems requiring sustained performance over extended product lifecycles.

Configuration PROMs For FPGAs Feature Summary

  • Integrates high-efficiency Zen core architecture for superior performance-per-watt ratios in edge environments
  • Includes built-in hardware security features to ensure data integrity and system resilience
  • Offers flexible I/O configurations adaptable to diverse industrial and embedded platform requirements
  • Engineered for extended product availability and long-term supply chain stability

Configuration PROMs For FPGAs Applications

  • Industrial automation and control systems
  • Edge AI inference and machine vision processing
  • Automotive infotainment and telematics units
  • Network infrastructure and communication gateways

Configuration PROMs For FPGAs Procurement Notes

Verify the specific suffix codes against official AMD documentation to confirm exact stepping, temperature range, and packaging variants. Ensure compatibility with existing motherboard designs by cross-referencing pinout and power delivery specifications. Confirm end-of-life status and recommended replacement paths if sourcing for new production runs. Request official datasheets directly from AMD or authorized distributors to validate technical parameters before integration.

Configuration PROMs For FPGAs Selection Notes

Select this processor when high single-thread and multi-thread performance is required alongside strict power constraints in embedded deployments. Evaluate thermal management capabilities based on the specific enclosure design and ambient operating conditions. Consider the availability of software support and driver maturity for the target operating system. Assess whether the integrated graphics or NPU capabilities meet the specific visual or AI workload demands of the application.

Configuration PROMs For FPGAs Part Context

This component falls under the AMD Ryzen Embedded processor portfolio, which targets the embedded market with x86 compatibility and high performance. It shares architectural lineage with consumer and server Ryzen processors but is optimized for longer lifecycle support and ruggedized operation. The series is part of AMD's broader strategy to provide scalable computing solutions across various verticals using consistent core technologies.

Configuration PROMs For FPGAs Replacement Considerations

Consult AMD's official obsolescence notices for direct substitutes within the same generation. Review next-generation Ryzen Embedded models for improved performance metrics and feature sets. Verify mechanical and electrical compatibility before transitioning to alternative SKUs to avoid redesign efforts.

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