XC17S50ASO20I

Overview

The XC17S50ASO20I is a one-time programmable (OTP) configuration PROM designed for AMD Field Programmable Gate Arrays. It provides 500 kilobits of non-volatile storage capacity to store FPGA bitstream data. The device is housed in a 20-pin Small Outline Integrated Circuit (SOIC) package. It operates within the industrial temperature range, ensuring reliable performance in demanding environments. This component serves as a dedicated memory solution for configuring AMD FPGA devices upon power-up.

Feature Summary

• Provides non-volatile storage for FPGA configuration data
• Designed specifically for AMD FPGA initialization
• Industrial temperature rating for robust operation

Applications

• FPGA system configuration
• Industrial control systems
• Embedded hardware design

Procurement Notes

Verify the exact suffix 'SO20I' to confirm the 20-pin SOIC package and industrial temperature grade. Ensure compatibility with the target AMD FPGA family before procurement. Confirm that the OTP nature of the device aligns with the production volume requirements, as data cannot be reprogrammed after writing.

Selection Notes

Select this part when a dedicated, low-cost configuration memory is required for AMD FPGAs. Compare against other XC17 series variants based on required bit depth and package constraints. Consider the industrial temperature range if the application environment exceeds standard commercial limits. Verify pinout compatibility with existing board layouts.

Part Context

This component belongs to the AMD XC17 series of configuration PROMs. These devices are engineered to simplify the boot process of AMD FPGAs by storing the necessary configuration bits. The series offers various densities and packages to suit different design needs, providing a reliable alternative to external flash memory solutions for specific FPGA architectures.

Replacement Considerations

Check for direct cross-references within the XC17 series, such as the XC17512LSO20I, noting differences in storage density. Ensure any substitute maintains the same 20-SOIC package and industrial temperature specifications to fit existing hardware constraints without modification.