XCVM1302-2MLENSVF1369

Soc System On Chip Overview

The AMD XCVM1302-2MLENSVF1369 is a Versal Premium Adaptive SoC from the Xilinx portfolio, designed for high-performance data center and infrastructure applications. It integrates large-scale programmable logic with AI Engines, DSP blocks, and hardened processor subsystems. The device utilizes a 1369-ball package to support extensive I/O requirements. Key specifications include approximately 5,480 K system logic units, roughly 2,500,000 LUTs, and about 10,000 DSP engines. The processing subsystem typically comprises dual-core Arm Cortex-A72 processors and dual-core Cortex-R5F real-time cores. It features high-speed serial transceivers capable of supporting advanced interface protocols essential for modern networking and storage acceleration.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining programmable logic, AI Engines, and hardened processor cores for flexible hardware acceleration.
• Integrated high-bandwidth memory controllers and extensive I/O options for complex system interconnectivity.
• Advanced security features including hardware root of trust and secure boot capabilities for enterprise environments.

Soc System On Chip Applications

• Data center network acceleration and packet processing
• High-performance computing (HPC) simulation and analysis
• Enterprise storage and database acceleration

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official AMD documentation to ensure correct temperature range, packaging type, and delivery tape/reel specifications. Confirm availability through authorized distributors as lead times may vary based on production schedules. Ensure compatibility with required development tools such as Vivado and Vitis before ordering.

Soc System On Chip Selection Notes

Select this model when requiring a balance of massive parallel processing capability and deterministic control within a single chip. Evaluate the specific resource needs for AI inference versus general-purpose logic to ensure the XCVM1302 tier provides sufficient DSP and AI Engine tiles. Consider thermal design power requirements and PCB layer count constraints associated with the high-pin-count package.

Soc System On Chip Part Context

This component belongs to the AMD/Xilinx Versal Premium Adaptive SoC family, which targets demanding workloads in telecommunications, industrial automation, and cloud infrastructure. It sits above the Versal Edge series in terms of performance and resource density, offering enhanced connectivity and compute capabilities compared to standard FPGA or lower-tier adaptive SoC solutions.

Soc System On Chip Replacement Considerations

Direct replacements within the same package are limited; consider adjacent models in the XCVM1302 series with different speed grades or suffixes if pinout compatibility is critical. Cross-family migration to Versal Prime or Versal Edge requires significant architectural redesign due to differences in AI Engine integration and processor subsystem configurations.