XCVM1302-2MLEVFVC1596

Soc System On Chip Overview

The AMD XCVM1302-2MLEVFVC1596 is a Versal Prime Series Adaptive SoC designed for high-performance computing and connectivity applications. It integrates dual-core Arm Cortex-A72 application processors, dual-core Arm Cortex-R5F real-time processors, and a platform management controller with programmable logic infrastructure. The device features up to 1,476 DSP engines, 1,476 system logic cells (K), and 673,920 LUTs. It supports maximum I/O pins of 770 and includes four integrated memory controllers. Connectivity options include PCIe Gen4 interfaces and SFP28/QSFP28 optical ports, targeting data center acceleration and 5G networking.

Soc System On Chip Feature Summary

• Combines software-programmable silicon infrastructure with dedicated compute engines for diverse workload acceleration
• Integrates scalable AI Engines and DSP blocks optimized for low-latency inline processing
• Provides flexible connectivity through programmable NoC and multiple high-speed serial transceivers

Soc System On Chip Applications

• Data center network and storage acceleration
• SmartNIC and 5G xHaul infrastructure
• Nx100G Ethernet and OTN networking equipment
• Communications test and measurement systems

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against official AMD documentation to confirm package type, temperature range, and speed grade. Ensure compatibility with required development tools such as Vitis Unified Software Platform. Confirm RoHS compliance status and supply chain availability directly with authorized distributors or AMD sales representatives prior to procurement planning.

Soc System On Chip Selection Notes

Select this component when requiring a balance of programmable logic density and fixed-function compute engines for networking workloads. Compare DSP engine counts and memory controller bandwidth against alternative Versal Prime models like the VM1502 or VM1802 based on specific throughput requirements. Evaluate power consumption profiles and thermal design constraints for the target FCBGA package implementation in the final hardware design.

Soc System On Chip Part Context

This part belongs to the AMD Versal Prime series, which targets mid-range adaptive SoC markets. It sits between the AI Edge and HBM series in terms of feature set, focusing on connectivity and general-purpose acceleration rather than specialized AI inference or extreme memory bandwidth. It complements the broader Versal portfolio by offering cost-effective scalability for enterprise infrastructure.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited. Consider upgrading to higher-density Versal Prime devices such as the XCVM1502 or XCVM1802 if additional logic resources or DSP capacity are needed. Downgrade options may exist in lower-tier Prime models if performance headroom allows, but verify interface and memory controller compatibility.